IPC Reveals Growing Industry Support for the CFX Initiative


Reading time ( words)

IPC – Association Connecting Electronics Industries is proud to announce the growing involvement of the Connected Factory Exchange (CFX). The 2-17 Connected Factory Initiative Subcommittee is comprised of representatives of the electronic industry’s leading manufacturers, machine, device, sensor and software companies. 

The Connected Factory Initiative is growing rapidly with nearly 90 members currently participating in the committee. There are 6 software vendors, 12 tier one EMS and OEM manufacturers, and 37 machine and device vendors. Device vendor involvement extends the reach of CFX even into the barcode scanners, materials handling equipment, and sensors within the factory. 

Together, with such strong involvement and collaboration of the industry, and support of IPC, the committee’s work is leading to the creation of a modern, Internet of Things based method for creating factory data exchange in an elegant, cost effective, open, and free manner. 

“Great collaboration and support from various entities to drive CFX, and the progress made at IPC APEX EXPO 2017 is going to be one giant leap in the march towards Industry 4.0 for the PCBA/Electronics Product ecosystem,” said 2-17 subcommittee co-chair Mahi Duggirala, Director, Enterprise Solutions, flex. This collaboration is yielding great results. At IPC APEX EXPO 2017, the committee demonstrated its strong belief that consensus and technical perspective sharing among a full cross section of the industry is critical to future adoption and success of CFX.  Despite a successful vote on the transport technology or CFX, a task group was reopened to deepen the technical analysis. Thus, the final transport is within a week of adoption. 

An additional task group has begun work on the unprecedented CFX data model, accepted as the approach to be taken with near unanimity at IPC APEX EXPO. This is being called the ‘Lego Brick’ approach because it models the data emerging from a type of device or machine or system not in the machine-type monolithic manner of the past, but as a collection of structured ‘capabilities’ that are joined together to establish a full and yet extensible definition for an entire system or machine---even ones that are completely custom machines and machines that are ‘hybrid’ in nature such as printers with inspection systems within them. Such a data model is expected to speed implementation for the machine vendors, and ensure CFX proliferation into devices and machines that are not even yet on the drawing board of R&D labs. 

For more information on this committee and the developing standard, click here

Share


Suggested Items

Modeling an SMT Line to Improve Throughput

06/06/2018 | Gregory Vance, Rockwell Automation Inc., and Todd Vick, Universal Instruments Corp.
One of the major challenges for an electronics assembly manufacturing engineer is determining how an SMT machine will impact throughput. Typically, an SMT equipment supplier will ask for a few products to simulate the throughput capability of their machine. Unfortunately, if the engineer works in a high-mix, low-volume environment, he may need to know the impact of a new machine on 1,000 or more products.

RTW IPC APEX EXPO: Indium's Brook Sandy-Smith on PMI-Squared

05/25/2018 | Real Time with...IPC
Indium Corporation's Brook Sandy-Smith discusses ionic process residues on PCB assemblies and introduces the concept of "PMI-squared" (process material interaction investigation), the topic of an IPC Technical Buzz Session at IPC APEX EXPO 2018.

RTW IPC APEX EXPO: Inspection Technology Developments

05/22/2018 | Real Time with...IPC
Brian D'Amico, president of Mirtec Corp., speaks with I-Connect007 Technical Editor Pete Starkey about the challenges of miniaturization, increasing component density, and the shadowing of small components by taller ones, and how Mirtec has developed its inspection technology to ensure they remain at the leading edge.



Copyright © 2018 I-Connect007. All rights reserved.