Reading time ( words)
Acting U.S. Securities and Exchange Commission (SEC) Chairman Mike Piwowar said in an April 7, 2017 statement that the SEC is suspending enforcement of the costliest requirements of its conflict minerals rule.
The statement came following an April 3, 2017 U.S. District Court decision remanding the rule back to the SEC to address First Amendment violations. "Until these issues are resolved, it is difficult to conceive of a circumstance that would counsel in favor of enforcing Item 1.01(c) of Form SD," Piwowar said in a statement [Item 1.01(c) contains the due diligence requirements].
Piowar's statement referenced the costs of conducting due diligence inquiries, citing several sources including a March 16 letter from IPC.
Piwowar added that companies will not be required to conduct a due diligence review or an audit, which are both part of the process used to determine the origin of the minerals. However, companies will still need to furnish reports and do origin inquiries, as they have been doing.
Michael Ford, Aegis Software Corp.
There is no longer any significant disagreement that having an industry-wide standard for IoT communication is absolutely essential for digitalization of factories if they are going to deliver on Industry 4.0 performance expectations. Digitalization of manufacturing is the key business opportunity of the decade, whoever and wherever you are, so stand-up and be a part of it, and create your opportunities.
Stephen Las Marias, I-Connect007
Garret Maxson, manager of engineering services at American Computer Development Inc. (ACDi), discusses the PCB assembly challenges when dealing with high-density interconnect (HDI) boards, parameters to consider, and strategies to help facilitate a smooth assembly process when using HDI boards.
Reza Ghaffarian, Jet Propulsion Laboratory, California Institute of Technology
Electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish for PCBs has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This article presents the reliability of LGA component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.