Vi TECHNOLOGY to Showcase Complete Inspection Solution for Smart Factories at NEPCON China


Reading time ( words)

Vi TECHNOLOGY will exhibit at NEPCON China, which is scheduled to take place April 25-27, 2017 at the Shanghai World EXPO Exhibition & Convention Center. The company will exhibit with three of its manufacturers' representatives—WKK (Stand 1F50), AmericanTec (Stand 1H48) and First Tech (Stand 1G50). Vi TECHNOLOGY will display its 5K3D AOI coupled with the PI Series 3D SPI and SIGMA Link to create a complete inspection solution for smart factories.

Vi TECHNOLOGY's innovative process improvement software, SIGMA Link, coupled with two high performance systems, from the PI Series (3D SPI) and K Series3D (3D AOI) product families, introduces a new era in process control. The result is one integrated solution for automated optical inspection, with a live link between systems and smart interface to really improve your SMT process and productivity. 

The new 5K3D is a 100 percent 3D AOI based on laser technology with angled cameras combined with the 2D Spectro optical solution. This new patented 3D AOI combination offers complete defect coverage with high precision metrology.  The awarded PI Series 3D SPI offers new horizons with programming-free software and unprecedented accuracy for small pads. These two measurement systems are the prerequisite for actionable data and process control.

For Smart Factories, SIGMA Link is the essential element to combine all inspection data and transform them into valuable information for the users. This real-time interface ensures full traceability and enables interlocking of machines to automate SMT lines while driving yields to new levels, especially important for the automotive, aerospace and defense sectors.

About Vi TECHNOLOGY

Vi TECHNOLOGY is a global designer, manufacturer and supplier of a wide range of innovative inspection equipment and software solutions for PCB assembly. Vi TECHNOLOGY serves very demanding market segments including telecoms, consumer, computer, automotive, infrastructure, industrial and medical. 

For more information, click here

Share


Suggested Items

RTW IPC APEX EXPO: COMET Technologies Highlights Product Range and New Facility

03/12/2018 | Real Time with...IPC
Craig Arcuri of COMET Technologies details the numerous ways his company's technology is employed to manufacture and inspect a wide range of products, from chips to jet engine turbine blades. He also speaks about Lab One, the company's new technology and application center in Silicon Valley.

Mycronic Announces the Acquisition of Vi TECHNOLOGY

02/21/2018 | Barry Matties, I-Connect007
Mycronic recently announced the acquisition of Vi TECHNOLOGY, with the intent of combining VIT’s inspection technology with Mycronic’s jetting capabilities. In an interview with I-Connect007, Olivier Pirou, Managing Director of VIT, discusses more about the merger and how this will help VIT contend in such a competitive environment.

Improving Design, Manufacturing and Assembly Teamwork

01/15/2018 | Syrma Technology
Many electronics manufacturers tend to compartmentalize or "silo" their departments, such as the design team versus assembly-related functions. The relationship between design and manufacturing can too often be disconnected or otherwise poor, which stalls productivity and increases bottom-line costs. By identifying and addressing these gaps, this financial hemorrhage can be reduced, and profitability increased.



Copyright © 2018 I-Connect007. All rights reserved.