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Alpha Assembly Solutions will be presenting a technical paper titled "Using Rheology Measurement as a Potentially Predictive Tool for Solder Paste Transfer Efficiency and Print Volume Consistency" at the SMTA China East Technical Conference 2017, which will be held on April 25 in Shanghai, China.
An estimated 80% of the defects associated with the surface mount technology process involve defects created during the printing process. Viscosity at a single shear rate could predict a fatal flaw in the printability of a solder paste sample. However, false positive single shear rate viscosity readings are not unknown.
This paper examines the correlation between rheology and print volume, and print volume repeatability of the pastes by using a cone and plate fixture on a variable speed rheometer. The goal is to determine if a specific set of viscosity vs. shear strain rate curves can predict the defect rate of a solder paste, and possibly create a more accurate prediction of the solder pastes value-in-use to users. The expectation is that this work will lead to a rich sequence of further valuable studies.
SMTA China East Technology Conference
Tuesday, April 25th / 11:05am-11:40am / Room No. 6-B2
Venue: Shanghai World Expo Exhibition & Convention Center, Shanghai, China
Topic: Using Rheology Measurement as a Potentially Predictive Tool for Solder Paste Transfer Efficiency and Print Volume Consistency
Speaker: William Yu – Senior Customer Technical Service Manager, Alpha Assembly Solutions
William Yu is the Senior Customer Technical Service Manager for Alpha Assembly Solutions in Northern China and his key responsibilities includes provision of technical and applications support, and providing advice & recommendations to a vast array of customers in mainland China. He is a member of IPC SPVC China. William joined Alpha N-China in June 2004 as a Customer Technical Service (CTS) engineer and became CTS manager in 2005. William has been at the forefront of Alpha' representation in key technical seminars and training sessions in N-China area and has more than 10 years of experience in the SMT Industry.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox® and Fortibond™ brands.
For the LED segment, Alpha offers its Lumet® products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.