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Federal policy on conflict minerals continues to move in the right direction, due in part to the persistent educational and advocacy efforts of organizations like IPC.
While IPC members share the widely held concerns about reports of mining-related human rights violations in the Democratic Republic of Congo (DRC), we believe that the U.S. Securities and Exchange Commission’s (SEC) rules have been ineffective in addressing these concerns and have had unintended negative effects.
IPC appreciates the April 7 statement by SEC Acting Chairman Mike Piwowar that the agency is suspending enforcement of the costliest requirements of its conflict minerals rule. The acting chairman’s statement refers specifically to IPC’s advocacy on this issue.
IPC encourages the SEC and Congress to keep moving in the direction of reducing this rule’s burdens on U.S. manufacturing industries and the people of the DRC.
Patty Goldman, I-Connect007
The IPC Rising Star Award is given to IPC members who have taken leadership roles and provided support to IPC standards, education, advocacy and solutions to industry challenges. Their contributions have made significant impact upon IPC and industry within the past five years and will continue to have a lasting impact for many years to come.
Dr. John Mitchell, IPC
After many months of planning, IPC APEX EXPO 2018 proved to be a success. From revolutionary advancements displayed on the show floor to expert insights conveyed in technical conference sessions and professional development courses, IPC APEX EXPO provided the learning and connections that helped 4,574 attendees from 43 countries prepare for the future.
Mark Whitmore and Jeff Schake, ASM Assembly Systems
A new generation of near microscopic size SMT chip capacitors has appeared in the market, known as either 0201 or 008004. This article investigates and characterizes the stencil printing process for compatibility with M0201 capacitor assembly. Effects of circuit board quality, stencil thickness, and stencil nano-coating are evaluated against solder paste volume transfer efficiency and raw-volume print distribution.