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Under today’s market and manufacturing environment, the effort to maximize production yield, reduce cost and assure product reliability has become increasingly important to a company’s competitiveness. On Wednesday, May 17, from 2:00 to 5:00 PM, Tutorial 6 will provide a holistic overview of product reliability and of critical “players” of the SMT assembly integrity and solder joint reliability at SMT/Hybrid/Packaging Conference in Nuremberg, Germany. Tutorial 6 emphasizes on practical working knowledge including the important roles of materials, processes and testing/service conditions, as well as the crucial principles behind the product reliability.
Dr. Jennie S. Hwang leverages on the confluence of her in-depth knowledge and comprehensive real-world experiences to address the subject. Join your industry colleagues to hear the true authority in manufacturing and reliability.
Fore registration and tutorial info, click here.
Burton Carpenter, NXP Semiconductors Inc.
It has been long established that packages using NSMD BGA pads were more resilient than ones with SMD pads to fatigue-induced solder joint cracks. However, NSMD pads in previous investigations on 292MAPBGA and 416PBGA packages failed sooner in AATS testing due to an alternate failure mode: substrate Cu trace cracks. This article looks into the effects of substrate material and package pad design on solder joint reliability of 0.8 mm pitch BGA.
Stephen Las Marias, I-Connect007
Paul Salerno, global portfolio manager for SMT assembly solutions at Alpha Assembly Solutions, discusses the growing automotive electronics industry, its impact on the soldering materials business, and how Alpha helps customers address the new challenges and requirements in the automotive market.
Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.