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Under today’s market and manufacturing environment, the effort to maximize production yield, reduce cost and assure product reliability has become increasingly important to a company’s competitiveness. On Wednesday, May 17, from 2:00 to 5:00 PM, Tutorial 6 will provide a holistic overview of product reliability and of critical “players” of the SMT assembly integrity and solder joint reliability at SMT/Hybrid/Packaging Conference in Nuremberg, Germany. Tutorial 6 emphasizes on practical working knowledge including the important roles of materials, processes and testing/service conditions, as well as the crucial principles behind the product reliability.
Dr. Jennie S. Hwang leverages on the confluence of her in-depth knowledge and comprehensive real-world experiences to address the subject. Join your industry colleagues to hear the true authority in manufacturing and reliability.
Fore registration and tutorial info, click here.
Barry Matties, I-Connect007
Tom Forsythe, vice president of KYZEN, spoke to Barry Matties about KYZEN’s new process control monitoring and data service. They discussed the drivers behind these developments, the company's focus on managing data, and how KYZEN plans to support an industry embracing more cleaning and Industry 4.0.
Ken Horky, Peterson Manufacturing
Electronic assembly thermal management has always been an issue but has become more significant as we pack more power and function into a smaller form factor. In recent years, the growing use of LEDs for illumination on a large scale has presented additional thermal demands.
Real Time with...IPC
Voiding has increasingly become one of the most critical challenges in the soldering process. In this interview, Christopher Nash, product manager for the PCB assembly solder paste business of Indium, speaks about how the company is helping customers address the voiding challenge.