Super Dry Launches Solder Paste Storage with Traceability


Reading time ( words)

Moisture specialist Super Dry Totech has launched new solutions for solder paste storage, bringing both temperature control and 4.0 traceability while eliminating the uncontrolled management of solder inventory.

Solder paste is a shelf-life dependent item and manufacturers recommend it be stored in a First In-First Out manner. Refrigerated storage prolongs the shelf life of solder paste and upon delivery, it should be directly placed into refrigerated storage, typically30°C for extended periods of time may no longer perform as expected. Prior to use, solder paste must be brought gently to the temperature conditions in which it will be used, which means movement to another location, for up to one day.

Newly launched Model XSDC 601 solder paste storage cabinets with network compatibility maintain an internal temperature of 2 - 20°C with little energy expenditure. Constructed from dual wall insulated stainless steel, they incorporate 40 KG capacity shelves and provide complete traceability of the storage conditions and environment history.  Maintaining tracking of paste locations and time in and out of refrigeration are also possible with additional software.

About Super Dry Totech

Delivering globally to the world’s top tier OEM and EMS companies, Super Dry Totech is the industry measure for ultra-low humidity storage and management. Proper control of moisture sensitive devices (MSDs) per IPC and JEDEC standards has become more critical than ever since the introduction of lead free. Boasting click here.

Share

Print


Suggested Items

IPC APEX EXPO 2020 Attendees Speak: Dr. Martin Anselm

02/14/2020 | I-Connect007 Editorial Team
"The biggest challenge I’ve encountered a number of different times is the migration to much larger packaging," said Dr. Martin Anselm, director of CEMA Lab. "Devices are getting much larger, and with the thousands of I/O of solder joints, and they are not just single-die, multi-chip modules in different forms or 2.5D technologies. Further, there are challenges associated with soldering. How do we go away from traditional soldering technologies or methodologies where these devices are so complex that warpage or alloy or reliability is driving us into unknown territories with soldering methodologies?

LPKF on Stencils and Depaneling

02/11/2020 | I-Connect007 Editorial Team
Stephan Schmidt and Mirela Orlowski of LPKF Laser & Electronics North America discuss laser technology in cutting stencils and depaneling circuit boards as a factor in shrinking component sizes and why few people in the industry realize how much of an impact the stencil can have on the manufacturing line.

Clean vs. No-clean: A Generational Difference

12/24/2019 | Barry Matties, I-Connect007
Tom Forsythe, executive VP of KYZEN, discusses what readers should know about cleaning as reliability expectations continue to increase. He also explains what is driving the new interest in cleaning and why engineers from the no-clean generation may not even realize they need to learn more about cleaning.



Copyright © 2020 I-Connect007. All rights reserved.