Super Dry Launches Solder Paste Storage with Traceability


Reading time ( words)

Moisture specialist Super Dry Totech has launched new solutions for solder paste storage, bringing both temperature control and 4.0 traceability while eliminating the uncontrolled management of solder inventory.

Solder paste is a shelf-life dependent item and manufacturers recommend it be stored in a First In-First Out manner. Refrigerated storage prolongs the shelf life of solder paste and upon delivery, it should be directly placed into refrigerated storage, typically30°C for extended periods of time may no longer perform as expected. Prior to use, solder paste must be brought gently to the temperature conditions in which it will be used, which means movement to another location, for up to one day.

Newly launched Model XSDC 601 solder paste storage cabinets with network compatibility maintain an internal temperature of 2 - 20°C with little energy expenditure. Constructed from dual wall insulated stainless steel, they incorporate 40 KG capacity shelves and provide complete traceability of the storage conditions and environment history.  Maintaining tracking of paste locations and time in and out of refrigeration are also possible with additional software.

About Super Dry Totech

Delivering globally to the world’s top tier OEM and EMS companies, Super Dry Totech is the industry measure for ultra-low humidity storage and management. Proper control of moisture sensitive devices (MSDs) per IPC and JEDEC standards has become more critical than ever since the introduction of lead free. Boasting click here.

Share


Suggested Items

Solder Printing Process Inputs Impacting Distribution of Paste Volume

12/14/2017 | Marco Lajoie and Alain Breton, C-MAC Microelectronics
The volume of solder deposition, like any process, has variations that may be characterized by a statistical distribution curve, whether normal or non-normal. As complexity, density, cost and reliability requirements increase, there may be value in narrowing the distribution curve. It is common sense that less variation serves the interest of quality of the more complex and dense circuit boards.

Improving Solder Paste Printing

12/12/2017 | Stephen Las Marias, I-Connect007
Of the three elements involved in the solder paste printing process—stencil, solder paste, and printer—the stencil is considered one of the major factors affecting the transfer efficiency, accuracy, and consistency, of solder pastes into the pads, especially with the continuing trend towards miniaturization.

Equipment Matters in Solder Paste Printing

12/06/2017 | Stephen Las Marias, I-Connect007
The solder paste printing process has always been considered a major contributor to yield loss. According to many studies, solder paste printing accounts for up to 70% of all PCB assembly defects. For the December issue of SMT Magazine, we interviewed experts in the solder paste printing process to learn more about the key issues leading to this huge percentage of defects, and the technology developments that are addressing these challenges and improving yields in the process.



Copyright © 2017 I-Connect007. All rights reserved.