Mirtec Europe to Exhibit at SMT Hybrid Packaging 2017

Reading time ( words)

Mirtec will display its award-winning 3D AOI and SPI inspection systems in pb tec's booth, in Hall 4A, Stand 140 at the upcoming SMT Hybrid Packaging 2017 show, scheduled to take place May 16-18 at the Messe in Nuremberg, Germany.

Mirtec is a strong presence at the show each year, and 2017 is no exception. Mirtec is planning to display several systems, including the MV-6E OMNI, MV-7OMNI, MS-11, and the Intelli-Sys Inc. Intelli-Track.

Mirtec's MV-6E OMNI is unquestionably the inspection industry’s most technologically advanced AOI system in consideration. This all-new MV-6E OMNI 3D inline AOI system is configured with Mirtec's exclusive OMNI-VISION 3D inspection technology which combines our award winning 15-megapixel ISIS Vision System with Mirtec's revolutionary Digital Multi-Frequency Eight Projection 3D system to provide precision inspection of SMT devices on finished PCB assemblies.

Mirtec's 15-megapixel ISIS Vision System is a proprietary camera system designed and manufactured by Mirtec for use with our complete product range of inspection equipment. Mirtec's Digital Multi-Frequency Eight Projection Technology provides true 3D inspection using a total of four programmable digital moiré projectors. This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured, the new Mirtec MV-6e OMNI machines feature four 10-megapixel side-view cameras in addition to the 15-megapixel top-down camera.

Mirtec's MV-7 OMNI-QHD 3D AOI machine features the next generation of Mirtec's award-winning OMNI-VISION 3D inspection technology in a high-performance AC servo drive platform. This revolutionary technology combines our proprietary 15MP CoaXPress Vision System with Mirtec's exclusive Quantum High Definition (2048x1536) Digital Multi-Frequency 3D projection technology to provide unprecedented image quality, accuracy and repeatability necessary for precision inspection of SMT devices on finished PCB assemblies. This new technology will, undoubtedly, set the standard by which all other 3D inspection equipment will be measured. The MV-7 OMNI-QHD machine also features four 10-megapixel side-view cameras for inspection of regions of interest which are not accessible with the 15-megapixel top-down camera. 

The MS-11 3D In-Line SPI Machine is configured with Mirtec's exclusive 15MP ISIS Vision System, providing enhanced image quality, superior accuracy and incredibly fast inspection rates. The machine uses Dual Projection Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste depositions on PCBs post screen print for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. The MS-11 uses the same robust platform as Mirtec's MV-7 OMNI Series.

Mirtec's total quality management system software, INTELLISYS also will be on display at the SMT Nuremberg show. This software suite promotes continuous process improvement by allowing manufacturers to track and eliminate defects on inspected assemblies.

Mirtec Europe prides itself on its business philosophy of providing customers with the highest quality products and services at competitive pricing, and recognizes that customers are the source of future growth and, as such, strives for a strong, reliable and long-term partnerships based on trust and respect.

To learn more about Mirtec, stop by Hall 4A, Stand 140 at the show.

About Mirtec

Mirtec is a leading global supplier of Automated Optical Inspection Systems to the Electronics Manufacturing Industry. For further information, click here.


Suggested Items

Solder Printing Process Inputs Impacting Distribution of Paste Volume

12/14/2017 | Marco Lajoie and Alain Breton, C-MAC Microelectronics
The volume of solder deposition, like any process, has variations that may be characterized by a statistical distribution curve, whether normal or non-normal. As complexity, density, cost and reliability requirements increase, there may be value in narrowing the distribution curve. It is common sense that less variation serves the interest of quality of the more complex and dense circuit boards.

Improving Solder Paste Printing

12/12/2017 | Stephen Las Marias, I-Connect007
Of the three elements involved in the solder paste printing process—stencil, solder paste, and printer—the stencil is considered one of the major factors affecting the transfer efficiency, accuracy, and consistency, of solder pastes into the pads, especially with the continuing trend towards miniaturization.

Equipment Matters in Solder Paste Printing

12/06/2017 | Stephen Las Marias, I-Connect007
The solder paste printing process has always been considered a major contributor to yield loss. According to many studies, solder paste printing accounts for up to 70% of all PCB assembly defects. For the December issue of SMT Magazine, we interviewed experts in the solder paste printing process to learn more about the key issues leading to this huge percentage of defects, and the technology developments that are addressing these challenges and improving yields in the process.

Copyright © 2017 I-Connect007. All rights reserved.