Flex Officially Opens New Design Center in Israel


Reading time ( words)

EMS firm Flex Ltd has officially opened its new design center in Haifa, Israel. The Haifa Design Center was founded at the end of 2012 as part of Flex’s medical research and design initiatives. Due to the increase in projects and the number of hires, in December of 2016, the center was moved to a new 1,000m2 facility located in the southern part of Haifa. It is close to several large international companies such as: Google, Microsoft, Amdocs, Qualcomm, GE, Phillips, Intel, Elbit, Novocure. Currently, the center holds 40 expert design engineers on-site.

The new facility accommodates several labs to support ongoing projects and is equipped for electronic integration and testing, firmware inspection, mechanical assembly and 3D printing. It also has a mechanical workshop, a special lab for optical inspection and assembly, and a lab to support water purification systems.

During the opening of the new facility, Ziva Eger, Chief of Foreign Investment and Industrial Cooperation Authority in Israel, commented, "Flex is one of the key partners for the State of Israel in helping to build the Israeli economy."

Today, the Haifa design center is focused on projects from the medical, industrial, consumer and defense categories and is also the home for two additional Flex groups—the medical technology center and the Flexible Technologies and Miniaturization CoE.

Share




Suggested Items

Assemblers Play the ‘Revise or Wait’ Game With Designers

06/22/2022 | Nolan Johnson, I-Connect007
Nolan Johnson recently spoke with Duane Benson at Milwaukee Electronics and Screaming Circuits. Duane was pointing out a trend in moving designs into production, which he termed “revise or wait.” This excerpt provides a preview of our exploration of similar topics involving supply chain issues, lead times, and proceeding forward despite the supply challenges.

How Will Emerging Chiplet Technology Affect PCBs?

06/01/2022 | I-Connect007 Editorial Team
In a recent conversation with Ventec’s Alun Morgan, the I-Connect007 Editorial Team discussed, among several topics, semiconductor packaging developments. Industry insiders will know that, when you get Happy Holden and Alun Morgan talking about emerging technology trends, there will be insights shared.

Getting Involved Earlier in the Test Process

04/18/2022 | Andy Shaughnessy, I-Connect007
At SMTA Dallas, Andy Shaughnessy stopped by the booth for The Test Connection, to find out from Bert Horner why the company has evolved into spending more time educating and consulting with their customers when it comes to testing new designs.



Copyright © 2022 I-Connect007. All rights reserved.