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During the recent IPC APEX EXPO 2017 show in San Diego, California, Christopher Larocca, president and CEO of OK International (of which Metcal is a division), tells I-Connect007 Publisher Barry Matties their strategy for improving the hand solder process.
Larocca describes a lack of process feedback to the operator as a core problem inherent in the hand soldering process. He discusses how the team at Metcal has developed an innovative solution to address the issue and to take another step in their Industry 4.0 strategy.
To view the whole video, click here.
Michael Ford, Aegis Software Corp.
There is no longer any significant disagreement that having an industry-wide standard for IoT communication is absolutely essential for digitalization of factories if they are going to deliver on Industry 4.0 performance expectations. Digitalization of manufacturing is the key business opportunity of the decade, whoever and wherever you are, so stand-up and be a part of it, and create your opportunities.
Stephen Las Marias, I-Connect007
Garret Maxson, manager of engineering services at American Computer Development Inc. (ACDi), discusses the PCB assembly challenges when dealing with high-density interconnect (HDI) boards, parameters to consider, and strategies to help facilitate a smooth assembly process when using HDI boards.
Reza Ghaffarian, Jet Propulsion Laboratory, California Institute of Technology
Electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish for PCBs has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This article presents the reliability of LGA component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.