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AIM Solder is pleased to announce that Carlos Tafoya, International Technical Support Director, will present at the SMTA TechDay Continental Cuatla, scheduled to take place on April 27th, 2017 at Continental Cuatla in Mexico. AIM will also highlight its revolutionary REL61 lead-free solder alloy, along with its full line of solder assembly materials, including its newly developed REL22™ solder alloy for extremely harsh environments.
Carlos will present his white paper “Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction.” Many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. Carlos’ presentation will highlight a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.
About Carlos Tafoya
Carlos Tafoya received his B.S. in Industrial Engineering from the University of Texas – El Paso. He joined AIM in 2005, bringing with him over two decades of experience in the electronics assembly industry. Carlos currently oversees AIM’s technical support teams based in USA, Canada, Mexico, South America, Europe, China and India.
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, click here.