Mirtec Exhibiting New Inspection Systems at NEPCON China 2017

Reading time ( words)

Mirtec is exhibiting its latest inspection machines equipped with new cutting-edge technologies this week at NEPCON China 2017, one of the biggest technical exhibitions for SMT and electronics manufacturing assembly. NEPCON China is being held from April 25-27 at the Shanghai World EXPO Exhibition & Convention Center. Mirtec is at Booth 1J10.

Mirtec's new machines have been developed under the concept "Perfect Inspection Solution", an inspection concept involving the combination of 3D, 2D, and side-camera inspection.

"We are very excited about these new products that we will be presented at NEPCON China 2017," stated Kane Bae, President of Mirtec's Chinese Sales and Service Division. "Mirtec will feature a total of six inspection systems specifically designed to address the full spectrum of inspection requirements associated with the electronics manufacturing industry. Not only SMT but semiconductor/LED manufacturing. We will introduce our new machines in advance."

The MV-6 (18M) is the world's highest spec 2D AOI system, with an 18-megapixel center camera, 7.3 µm lens and 18-megapixel side camera. Inspection speed has been increased dramatically by upgrading pixel resolution while improving the lens spec with a 7.3 µm precision lens capable of inspecting 0201 (mm) chips.

Mirtec's upgraded side camera system will be applied from 10-18 megapixels, which is a pixel resolution improvement of 80 percent. The four side cameras will now inspect PCBs with the center camera at the same time, eliminating inspection speed issues.

The side camera is specialized to inspect QFN and J-lead solder, which cannot be inspected with 3D or center cameras. Therefore, a combination of center and side camera inspection makes for a perfection inspection solution. Furthermore, whole-PCB inspection with side cameras will be possible, which is a technology exclusive to Mirtec.

In addition, an eight-phase coaxial color lighting system supports micro-crack and reflective surface component inspection, while the Intelli-Scan® laser can be attached for lifted lead inspection by measuring lead heights via laser sensor.

The MV-3 OMNI is Mirtec's new offline 3D desktop AOI. Mirtec is sure that this system will be one of the most revolutionary machines this year. A few companies have launched offline 3D AOI already, but have faced challenges entering the market due to their low performance and high cost. Offline AOI is primarily used for small quantity batch production or subcontracted production because of its space utilization and material handling method. Mirtec developed an off-line 3D AOI for manufacturers that require 3D inspection but not specifically inline.

The distinguishing feature of the MV-3 OMNI is its optical system. Other off-line 3D AOI suppliers have low-tier optical systems compared with the optics of their in-line equipment. Mirtec's MV-3 OMNI is equipped with the same optical system as the award winning MV-6 OMNI - 15 Mega Pixel CoaXPress center camera and 8 phase coaxial color lighting system. Like the new MV-6, the MV-3 OMNI is capable of simultaneous whole-PCB inspection with center and side cameras.

Mirtec's new offline 3D AOI, MV-3 OMNI, is not a low-grade version of our inline AOI. It brings the same high performance as an inline 3D AOI, catering to the needs of small batch manufacturers. Mirtec's existing products, well-known to customers, have been upgraded as well.

The award-winning MV-6 OMNI 3D AOI machine is configured with Mirtec's exclusive OMNI-VISION® 3D inspection technology which combines our 15-megapixel CoaXPress center camera with Mirtec's digital 8 projection moiré 3D system. Mirtec's Digital 8 projection Moiré system provides true 3D inspection using programmable digital moiré projectors to yield precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow. 8 phase coaxial color lighting system that make micro-crack and reflective component inspection possible. In addition, the revolutionary 18 mega pixel side camera system option for J-lead and QFN inspection is available for this machine, too. The MV-6 Omni provides full-coverage for all kinds of defects seen within the SMT industry.

The MV-9, the high-end 3D AOI of Mirtec is for those customers who need extremely precise inspection, like within the Semiconductor manufacturing industry. The MV-9’s astonishing 25-megapixel 7.7㎛ optics don’t miss any defects on component and solder, and its precision linear motor drive system provides high repeatability data.

The MS-11e, Mirtec's award-winning 3D SPI machine, is configured with its exclusive 15MP CoaXPress vision system, providing enhanced image quality, superior accuracy and incredibly fast inspection rates. This machine uses Dual Projection Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste depositions on PCBs post screen print for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. PCB warpage compensation is possible by using laser unit and Z-axis movement. The MS-11e uses the same robust platform as Mirtec's MV-6 OMNI Series.

The last machine to be introduced, the MV-9UP, is the most exotic inspection system among these machines. This machine is specialized for LED industry, for inspection for LED components’ package, chip, ball and wire after encapsulation. With its 3D HAP (High Accuracy Profile) sensor that has 0.4 µm accuracy, this machine can measure height of transparent epoxy on LED components, and its 25 megapixel 4/6µm top-down camera never miss defects on super-micro-size inspection items like wire and die on LED. Furthermore, its high-brightness 7 color lighting system supports inspection for micro crack on transparent epoxy.

Today, all SMT equipment manufacturers are focused on Industry 4.0, or realization of the Smart Factory. Mirtec showed a SPI-AOI-AXI connection with its Smart Loop system last year. The next step is to make a universal connection with all SMT manufacturing equipment.

One management system that Mirtec is excited to introduce is the SPC server. Other companies’ quality management systems are built-in or remote workstation systems, which have limitations on performance. Mirtec’s SPC server consists of a server system. It surpasses built-in or workstation systems for data collection, storing, analyzing and indexing speed. 

The SPC server can store two years of data and images for five machines at minimum system setting. At maximum system setting, the SPC server can store five years of data and images for 16 machines. Therefore, even if the factory has multiple production lines, only one SPC server is needed. Inspection data is duplicated whenever it is stored, in preparation for urgent situations.

The SPC server is a solution for manufacturers looking for an incredibly fast, big-data analyzing system that provides instant review data. The SPC server is the proper Smart Factory quality management system. 

"Mirtec has earned a solid reputation in the Chinese market, not only SMT but SEMI and LED industries also, by providing unquestionable performance, quality and cost-effectiveness to the customers," continued Bae. "We look forward to welcoming visitors to our booth 1J10 during the three-day event."

About Mirtec 

Mirtec is a leading global supplier of automated inspection systems to the electronics manufacturing industry.  For further information, please click here.


Suggested Items

Investigating Analytical Tools for Testing Cleanliness with Foresite's Eric Camden

04/19/2018 | Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.

Stencil Printing Techniques for Challenging Heterogeneous Assembly Applications

04/16/2018 | Mark Whitmore and Jeff Schake, ASM Assembly Systems
A new generation of near microscopic size SMT chip capacitors has appeared in the market, known as either 0201 or 008004. This article investigates and characterizes the stencil printing process for compatibility with M0201 capacitor assembly. Effects of circuit board quality, stencil thickness, and stencil nano-coating are evaluated against solder paste volume transfer efficiency and raw-volume print distribution.

Why AOI is a Must-have for PCB Assembly

04/05/2018 | Russell Poppe, JJS Manufacturing
AOI has an invaluable role to play in speeding up the process of PCB production, in ensuring extreme precision to catch even the smallest of defects, and in minimizing the potential for time-consuming and costly reworking.

Copyright © 2018 I-Connect007. All rights reserved.