RTW NEPCON China: Viscom Talks 3D AOI Developments


Reading time ( words)

Guido Bornemann, head of sales for Asia at Viscom, speaks with I-Connect007 Editor Stephen Las Marias about inspection challenges such as false calls and improving first pass yields. He also talks about the latest developments in 3D AOI to address these issues as well as test strategies to achieve zero defects.

Watch The Interview Here

Share

Print


Suggested Items

More Than Inspection: It’s Process Improvement

01/09/2019 | Barry Matties, I-Connect007
Barry Matties speaks with Brian D’Amico, president of MIRTEC, about the current state of machine-to-machine communication in the industry, and how the inspection company is interfacing with the different manufacturing languages currently available to gather predictive data and feedback from every inspection step to eliminate future defects.

AOI Programs with a Magic Click

12/12/2018 | Jens Kokott and Matthias Muller, Goepel electronic
Production runs of 10–1,000 assemblies are everyday life for an EMS provider. But what if important staff are on vacation, and component deliveries are very much delayed? And then the customer is determined to have AOI, but the layout of the assembly is highly customized, making it virtually impossible to use complete library entries. Here's how AOI programs can help you in these scenarios.

Tempo Automation's Open House Raises the Curtain in San Francisco

11/28/2018 | Nolan Johnson, I-Connect007
Based in San Francisco, Tempo Automation specializes in rapid PCB assembly and on low volume production for a wide range of board complexities. It recently held an open house at its brand-new facility in the South of Market (SoMa) district—which is normally restricted under customer non-disclosure agreements as well as International Traffic in Arms Regulations (ITAR) regulations—to customers, vendors, local designers, and government officials.



Copyright © 2019 I-Connect007. All rights reserved.