RTW NEPCON China: Viscom Talks 3D AOI Developments


Reading time ( words)

Guido Bornemann, head of sales for Asia at Viscom, speaks with I-Connect007 Editor Stephen Las Marias about inspection challenges such as false calls and improving first pass yields. He also talks about the latest developments in 3D AOI to address these issues as well as test strategies to achieve zero defects.

Watch The Interview Here

Share


Suggested Items

RTW IPC APEX EXPO: MEK on Increasing Demand for THT AOI Systems

04/25/2018 | Real Time with...IPC
Henk Biemans, managing director of MEK Marantz Electronics Ltd, speaks with I-Connect007 Managing Editor Stephen Las Marias about what's driving the increasing demand for THT AOI systems. Other topics discussed include reliability issues, articifial intelligence, and machine learning in inspection systems.

Interview with Yusaku Kono: Rising Star Award Recipient

04/18/2018 | Patty Goldman, I-Connect007
The IPC Rising Star Award is given to IPC members who have taken leadership roles and provided support to IPC standards, education, advocacy and solutions to industry challenges. Their contributions have made significant impact upon IPC and industry within the past five years and will continue to have a lasting impact for many years to come.

Automotive Electronics Still in the Driver’s Seat

04/11/2018 | Stephen Las Marias, I-Connect007
The past year was one of the strongest years that the PCB supply chain and the rest of the electronics manufacturing industry in general, has seen. Everyone we talked to at the shows were optimistic that the strong growth in the industry in 2017 will continue through 2018. And most industry players point to one thing when it comes to what’s driving this strong growth—automotive electronics.



Copyright © 2018 I-Connect007. All rights reserved.