May Issue of SMT Magazine Available Now


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The May 2017 issue of SMT Magazine is available now. This month, our contributors discuss the challenge of finding the right talent in the electronics manufacturing industry, and strategies in training them to further the growth of their companies.

Read the May issue of SMT Magazine, now on the virtual newsstand and available for delivery in your e-mailbox by subscribing here.

Save the PDF version to your devices for future reference.

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Creating the Perfect Solder Joint

11/03/2017 | Stephen Las Marias, I-Connect007
From a visual standpoint, a good solder joint should be smooth, bright, shiny, clean, and have a nice concave solder fillet. But how do you ensure that inside those joints, good intermetallic bonds are formed? Solder joints play several different roles, and they represent several different opportunities to be a problem, a partial improvement, or a complete improvement. Since all solder joints aren’t created equal, the first step is to understand what is expected or required of that joint.

Achieving the Perfect Solder Joint: The Many Perspectives on Soldering

10/30/2017 | Stephen Las Marias, I-Connect007
For this month's issue of SMT Magazine, we brought several experts together to discuss the many aspects of soldering, from solder paste, to automation, inspection, and the challenges in achieving the perfect solder joint. We also talked about the strategies and parameters to consider to ensure reliable, good solder joints.

X-Ray Inspection of Lead and Lead-Free Solder Joints

07/31/2017 | Glen Thomas, Ph.D., and Bill Cardoso, Ph.D., Creative Electron Inc.
As aerospace companies consider the shift to lead-free solder alloys and glues, concerns have been raised about whether their current X-ray inspection and quality-control procedures will still be valid. With lead solder, joints are easily interpreted by the operator or the system imaging software because lead provides excellent image contrasts due to relatively high X-ray absorption compared to that of PCB and component materials. Will this hold true as they shift to lead-free solder compounds?



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