Reading time ( words)
The May 2017 issue of SMT Magazine is available now. This month, our contributors discuss the challenge of finding the right talent in the electronics manufacturing industry, and strategies in training them to further the growth of their companies.
Read the May issue of SMT Magazine, now on the virtual newsstand and available for delivery in your e-mailbox by subscribing here.
Save the PDF version to your devices for future reference.
Real Time with...IPC
Voiding has increasingly become one of the most critical challenges in the soldering process. In this interview, Christopher Nash, product manager for the PCB assembly solder paste business of Indium, speaks about how the company is helping customers address the voiding challenge.
Barry Matties, I-Connect007
Barry Matties met with Karthik Vijay, Indium Corporation's technical manager for Europe, at last year's productronica, where everything from stencils and laser cutting to flux technology and jetting were discussed. If you want to know about where material technology currently stands in the automotive landscape, you’ll want to read on.
Stephen Las Marias, I-Connect007
While there may be new techniques and strategies, technologies, equipment, tools, and materials to employ and utilize, there is always one thing that will ensure the manufacturing/ assembly success of your product: communication. Communication between the designer and the assembler will help improve the manufacturability and assembly of the final product—even before the board design gets fabricated.