NEO Tech to Focus on Substrate and Microelectronic Assembly at IMS 2017


Reading time ( words)

EMS firm NEO Tech will showcase its high-reliability substrate and microelectronic assembly capabilities at the 2017 International Microwave Symposium, which is scheduled to take place June 6–8, 2017 at the Hawaii Convention Center in Honolulu. NEO Tech will be in Booth 1357.

During the symposium, NEO Tech will feature a range of its low-temperature co-fired ceramic (LTCC), high-temperature co-fired (HTCC), and microelectronics packaging technologies, including the following:

  • Ceramic Substrate manufacturing: thick film, ECP thick film, BeO substrates, AlN systems, plating and HTCC/LTCC package assemblies.
  • Extensive high-reliability microelectronics assembly technology including die attach, ceramic package wirebonding, COB laminates, device hermetic sealing and extensive product testing validation services.
  • Innovative AUTOLINE to economically produce complex RF microelectronic packages.

Additionally, the company will discuss its high frequency millimeter and microwave microelectronics assembly experience, which include package assembly, sealing and testing. With more than 40 years of experience in high-reliability hybrid and RF technologies, NEO Tech has emerged as North America’s largest microelectronics assembly services provider.

The IEEE MTT International Microwave Symposium (IMS) is the premier annual international meeting for technologists involved in all aspects of microwave theory and practice. It consists of a week of events, including technical paper presentations, workshops, and tutorials, as well as numerous social events and networking opportunities. The symposium also hosts a large commercial exhibition.

About NEO Tech

NEO Tech combines the strengths of three leading contract manufacturers: NATEL, EPIC, and OnCore. With over 40 years of heritage in electronics manufacturing, NEO Tech focuses on low-medium-volume/high-mix, high-complexity products primarily in the medical, defense/aerospace and industrial markets.

NEO Tech offers full product lifecycle engineering services, manufacturing and testing of microelectronics, cable & harness interconnect products, PCBA, full box build services and aftermarket repair and fulfillment services. The companies that form NEO Tech have been known for solving tough engineering problems that result in high-reliability, high-quality electronic solutions for customers.

Headquartered in Chatsworth, CA, NEO Tech has manufacturing and engineering locations in California, Colorado, Illinois, Massachusetts, Nevada, Ohio, Mexico, and China. NEO Tech holds and maintains industry specific certifications that include ISO9001, AS9100, ISO13485, ISO/TS16949, ISO14001 and MIL-PRF-38534. To learn more, click here.

Share


Suggested Items

Tempo Automation: Setting the Pace for Low-Volume, Quick-Turn Assembly

01/31/2018 | Patty Goldman, I-Connect007
Jesse Koenig, co-founder and VP of technology at PCB assembly company Tempo Automation, discusses with I-Connect007's Patty Goldman how they are making electronics development much easier and more seamless for customers.

Top 10 Most-Read SMT Articles of 2017

12/29/2017 | I-Connect007
Every year, we like to take a look back at the most popular SMT news and articles. These are the top 10 most-read SMT articles from the past year.

Industry 4.0 and the Platform-Based Approach to Testing

12/19/2017 | Stephen Las Marias, I-Connect007
Chandran Nair, the vice president for Asia Pacific at National Instruments, explains how the Industry 4.0 vision will change electronics manufacturing. He discusses key technology enablers that would drive the evolution of manufacturing processes, and how a platform-based approach can help improve test and measurement.



Copyright © 2018 I-Connect007. All rights reserved.