Balver Zinn Group to Supply BRILLIANT B2012 Solder Wire for the IPC Hand Soldering Competition


Reading time ( words)

The Balver Zinn Group will be sponsoring the IPC Hand Soldering Competition at the SMT Hybrid Packaging show, which is scheduled to take place May 16-18, 2017 in Nuremberg, Germany. Balver Zinn will be contributing its BRILLIANT B2012 solder wire which is halide-free, rosin based and designed for manual and robotic soldering.

BRILLIANT B2012 is odorless and shows excellent soldering and wetting performance. BRILLIANT B2012 is available in SN100C, SAC305 (SN97C) and Sn63 alloys with a standard flux content of 2.2 percent. Balver Zinn wires are available in diameters from 0.3 to 3.5mm. 

The IPC Hand Soldering Competition recognizes the best skills in hand soldering complex printed board assemblies. Hand soldering of high density printed circuit boards demands highly skilled industry professionals to ensure a zero-defect soldering process. 

During this competition, industry professionals will compete against each other to build a functional electronics assembly within a 60-minute time limit. Assemblies will be judged on soldering in accordance with IPC-A-610F Class 3 criteria. IPC-A-610 Master Instructors will serve as judges. The competition will be held at the IPC Hand Soldering Competition Hall 4, Booth #400.   

The Balver Zinn Group will highlight its latest products, technologies and services at the SMT Hybrid Packaging show in Hall 4, Booth #231.

About Balver Zinn Group 

Headquartered in Germany, the Balver Zinn Group has facilities in the United States, Europe and distributors in all major areas of the world. Balver Zinn – Cobar product range includes: solder bar, solder wire, solder flux, gel flux, cleaner, solder paste and miscellaneous service and soldering products. For information about the company’s complete range of solder materials, visit www.balverzinn.com or www.cobar.com.

Share


Suggested Items

Indium's Karthik Vijay Talks Engineering for Automotive Applications

01/22/2018 | Barry Matties, I-Connect007
Barry Matties met with Karthik Vijay, Indium Corporation's technical manager for Europe, at last year's productronica, where everything from stencils and laser cutting to flux technology and jetting were discussed. If you want to know about where material technology currently stands in the automotive landscape, you’ll want to read on.

PCB Pad Repair Techniques

01/08/2018 | Bob Wettermann, BEST Inc.
There are a variety of reasons behind pads getting "lifted" completely or partially from the laminate of a PCB. Per the just revised IPC-A-610 Revision G, a defect for all three classes occurs when the land is lifted up one or more pad thicknesses. Lifted pads can occur when a device has been improperly removed or there is a manufacturing defect in the board construction. In any case, as with any repair, the ultimate decision on the ability to repair the pad lies with the customer.

Top 10 Most-Read SMT007 Columns of 2017

01/02/2018 | I-Connect007
Another year is over in the SMT industry. 2017 saw a myriad of hot topics, including Industry 4.0, the millennials’ entry into the manufacturing space, and alternative solder materials, to name a few. Without further ado, here are the Top 10 columns from SMT007 over the past year.



Copyright © 2018 I-Connect007. All rights reserved.