AIM to Highlight REL61 at the SMTA Carolinas Expo & Tech Forum


Reading time ( words)

AIM Solder is pleased to announce their participation at the SMTA Carolinas Expo & Tech Forum, scheduled to take place on May 16th, 2017 at the Holiday Inn Greensboro Airport in Greensboro, NC. AIM will highlight their revolutionary REL61 lead-free solder alloy, along with their full line of solder assembly materials.

REL61 addresses the most challenging issues with today’s common lead-free alloys, specifically voiding, cost, durability and tin whiskers.  Combined with AIM M8 Solder Paste, REL61 has reduced voiding on BTC packages by over 45%, increasing both thermal performance and solder joint integrity. REL61 offers a low cost alternative to SAC alloys, with reliability and performance characteristics superior to SAC305 and other low/no-silver solder alloys. Extensive testing indicates that REL61 can reduce tin whisker formation as well as outperform SAC alloys in thermal shock, vibration and drop shock resistance.

AIM will highlight its full line of advanced solder materials, including its solder paste, liquid flux and solder alloys, including its newly developed REL22 solder alloy for extremely harsh environments. To discover all of AIM’s products and services, visit the company at the SMTA Carolinas Expo & Tech Forum for more information.

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, click here

Share


Suggested Items

Video from productronica 2017: Mycronic Discusses Precision Jetting Systems

11/17/2017 | I-Connect007
From the show floor during productronica 2017, Clemens Jargon, VP of Global Dispensing at Mycronic, discusses with I-Connect007 Technical Editor Pete Starkey the company’s portfolio of precision jetting equipment, with particular reference to the speed and versatility of the MYSmart series.

Solder Preforms 101: Ask the Expert

11/13/2017 | Patty Goldman, I-Connect007
At the recent SMTA International 2017 event, Jerry Sidone, product manager for the engineered materials at Alpha Assembly Solutions, speaks with I-Connect007 Managing Editor Patty Goldman about the voiding challenge, especially with bottom termination components, and how solder technologies from Alpha are helping PCB assemblers address this issue.

HDI Considerations: Interview with ACDi's Garret Maxson

11/10/2017 | Stephen Las Marias, I-Connect007
Garret Maxson, manager of engineering services at American Computer Development Inc. (ACDi), discusses the PCB assembly challenges when dealing with high-density interconnect (HDI) boards, parameters to consider, and strategies to help facilitate a smooth assembly process when using HDI boards.



Copyright © 2017 I-Connect007. All rights reserved.