Koh Young Singapore Relocates Office to Pasir Panjang

Reading time ( words)

3D inspection technology leader Koh Young Technology has relocated its Singapore office to Pasir Panjang, Singapore. The new office will serve as a sales, training, service and application support facility for Koh Young’s best-in-class 3D solder paste inspection (SPI), automated optical inspection (AOI) systems, and Smart Factory solutions. 

“We have seen our growth accelerate in recent years in Southeast Asia since we opened our Singapore office in KA Place, Singapore, in December 2013,” said Peter (Jong Hoon) Shin, General Manager of Koh Young Singapore. “Our new office space is 20 percent larger than our previous office, and allows us to continue to enhance our ability to serve our customers at the highest levels. It provides more space for training, machine demonstrations and application support, and empowers our customers to derive the greatest advantage from their Koh Young equipment. Our goal is to always help our customers increase productivity and efficiency by improving their manufacturing process.” 

Koh Young Singapore is now located at 108 Pasir Panjang Road, Golden Agri Plaza #03-13, Singapore 118535, Tel. +65 6634 2814. 

About Koh Young Technology Inc.

Koh Young Technology, a leading provider of Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) systems, specializes in the design and manufacturing of 3D measurement and inspection equipment for the global circuit board assembly and semiconductor markets. Direct sales and support centers are located in the United States, Germany, Japan, Singapore, China and Korea. For more information, click here.   



Suggested Items

Investigating Analytical Tools for Testing Cleanliness with Foresite's Eric Camden

04/19/2018 | Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.

Stencil Printing Techniques for Challenging Heterogeneous Assembly Applications

04/16/2018 | Mark Whitmore and Jeff Schake, ASM Assembly Systems
A new generation of near microscopic size SMT chip capacitors has appeared in the market, known as either 0201 or 008004. This article investigates and characterizes the stencil printing process for compatibility with M0201 capacitor assembly. Effects of circuit board quality, stencil thickness, and stencil nano-coating are evaluated against solder paste volume transfer efficiency and raw-volume print distribution.

Why AOI is a Must-have for PCB Assembly

04/05/2018 | Russell Poppe, JJS Manufacturing
AOI has an invaluable role to play in speeding up the process of PCB production, in ensuring extreme precision to catch even the smallest of defects, and in minimizing the potential for time-consuming and costly reworking.

Copyright © 2018 I-Connect007. All rights reserved.