AIM’s Timothy O’Neill to Present at TEC Warsaw


Reading time ( words)

AIM Solder is pleased to announce that Timothy O’Neill, Technical Marketing Manager, will present at TEC Warsaw on May 25th, 2017 at the DoubleTree by Hilton Hotel & Conference Centre in Warsaw, Poland. Additionally, AIM will highlight its revolutionary REL61 lead-free solder alloy, along with its full line of solder assembly materials.

Mr. O’Neill will present the white paper “New Pb-free Alloys for Improved Reliability,” at the technical forum from 10:30 – 11:00 AM. This paper addresses the development of high reliability soldering materials that can perform in harsh service conditions. Applications such has high performance LED lighting and under hood automotive require solder alloys to operate at temperatures as high as 150 °C where commonly used SAC305 could be prone to failure. In this study a novel high reliability lead-free solder alloy with superior creep resistance and mechanical properties is introduced and the soldering and mechanical performance of this alloy is studied and compared with the reference SAC alloy.

AIM will also highlight its innovative high reliability, lead-free solder alloys. REL61TM addresses the most challenging issues with today’s common lead-free alloys, specifically BTC voiding, cost, durability and tin whiskers. REL61TM offers a low cost alternative to SAC alloys, with reliability and performance characteristics superior to SAC305 and other low/no-silver solder alloys.  REL22™ is a high reliability, high strength lead-free solder alloy for extreme service environments, with reliability equal to Sn/Ag/Bi/Sb/Ni/Cu and a wider process window. To discover all of AIM’s products and services, visit the company at TEC Warsaw for more information.

About Timothy O’Neill

Timothy O'Neill is the Technical Marketing Manager for AIM Solder.  With nearly 25 years of experience in electronics soldering, Mr. O’Neill has co-authored several papers on PCB assembly subjects. He is a Certified IPC Specialist, a technical writer and presenter for industry trade publications and events. His commitment and dedication to sharing innovative solutions to challenging problems in the electronics assembly market have earned him recognition from the SMTA as Speaker of Distinction.

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, click here.

Share


Suggested Items

Solder Printing Process Inputs Impacting Distribution of Paste Volume

12/14/2017 | Marco Lajoie and Alain Breton, C-MAC Microelectronics
The volume of solder deposition, like any process, has variations that may be characterized by a statistical distribution curve, whether normal or non-normal. As complexity, density, cost and reliability requirements increase, there may be value in narrowing the distribution curve. It is common sense that less variation serves the interest of quality of the more complex and dense circuit boards.

Improving Solder Paste Printing

12/12/2017 | Stephen Las Marias, I-Connect007
Of the three elements involved in the solder paste printing process—stencil, solder paste, and printer—the stencil is considered one of the major factors affecting the transfer efficiency, accuracy, and consistency, of solder pastes into the pads, especially with the continuing trend towards miniaturization.

Equipment Matters in Solder Paste Printing

12/06/2017 | Stephen Las Marias, I-Connect007
The solder paste printing process has always been considered a major contributor to yield loss. According to many studies, solder paste printing accounts for up to 70% of all PCB assembly defects. For the December issue of SMT Magazine, we interviewed experts in the solder paste printing process to learn more about the key issues leading to this huge percentage of defects, and the technology developments that are addressing these challenges and improving yields in the process.



Copyright © 2017 I-Connect007. All rights reserved.