RTW NEPCON China: Data I/O on Securing the Supply Chain


Reading time ( words)

At the recent NEPCON China event in Shanghai, Anthony Ambrose, president and CEO of Data I/O Corp., and Managing Editor Stephen Las Marias discuss the cybersecurity challenges facing the electronics manufacturing industry today amid the proliferation of connected devices and the Internet of Things. Ambrose also focuses on traceability and security strategies to protect the electronics manufacturing supply chain.

Watch The Interview Here

Share


Suggested Items

I-Connect007 Survey Shows Rising Use of Flex and Rigid-Flex

07/24/2018 | I-Connect007 Research Team
In our recent survey on flex and rigid-flex circuits, the majority of our respondents indicated an increase in their use of flex and rigid-flex technologies in their designs, indicating a continued shift in flex technology usage. We bring you the survey details here.

Plasmatreat on Atmospheric Pressure Plasma

07/20/2018 | Barry Matties, I-Connect007
At the recent SMT Hybrid Packaging 2018 event held in Nuremberg, Germany, I-Connect007's Barry Matties sat down with Nico Coenen, global business development manager of Plasmatreat, for a discussion on Plasmatreat's atmospheric pressure plasma (AP plasma) treatment process and its various applications in the electronics industry.

Is There an End in Sight to the Electronic Components Crisis?

07/12/2018 | Neil Sharp, JJS Manufacturing
As new and innovative technology continues to evolve on a daily basis, the need for electronic components has reached unprecedented levels, with passive manufacturers in particular among those struggling to cope with demand. Electronic component shortages are now such an issue that many OEMs are predicting their forecasted growth for 2018-2019 will be thwarted if they are unable to source the parts they need.



Copyright © 2018 I-Connect007. All rights reserved.