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At the recent NEPCON China event in Shanghai, Anthony Ambrose, president and CEO of Data I/O Corp., and Managing Editor Stephen Las Marias discuss the cybersecurity challenges facing the electronics manufacturing industry today amid the proliferation of connected devices and the Internet of Things. Ambrose also focuses on traceability and security strategies to protect the electronics manufacturing supply chain.
Watch The Interview Here
Every year, we like to take a look back at the most popular SMT news and articles. These are the top 10 most-read SMT articles from the past year.
Neeta Agarwal, et al.*
SMT stencil printing technology continually evolves to keep pace with device miniaturization technologies. Printed circuit board assemblers have numerous new technology options to choose from, and need to determine the most effective ones to produce the highest quality and most reliable solder interconnections.
Marco Lajoie and Alain Breton, C-MAC Microelectronics
The volume of solder deposition, like any process, has variations that may be characterized by a statistical distribution curve, whether normal or non-normal. As complexity, density, cost and reliability requirements increase, there may be value in narrowing the distribution curve. It is common sense that less variation serves the interest of quality of the more complex and dense circuit boards.