RTW NEPCON CHINA: Mycronic Meets High-volume Demand with Solder Jet Printing


Reading time ( words)

Mycronic VP for Global Dispensing and Managing Director Clemens Jargon and Editor Stephen Las Marias discuss how the flexibility of solder jet printing helps reduce downtime in the line, thus increasing total line speed and enabling it to keep up with high-volume demand.

Jargon also focuses on their recent acquisition of China-based Shenzhen Axxon Automation Co. Ltd.; the difference between the quality of yields in stencil printing and jet printing technologies; and their Industry 4.0 strategy.

Watch The Interview Here

Share


Suggested Items

MacDermid Enthone to Exhibit and Present at Hong Kong Printed Circuit Association Show 2018

11/21/2018 | MacDermid Enthone Electronics Solutions
MacDermid Enthone Electronics Solutions to exhibit at HKPCA tradeshow, Shenzhen, China, December 5-7, 2018.

Survey: Low-Temperature Soldering on PCBAs

11/14/2018 | Stephen Las Marias, I-Connect007
The majority of the respondents in our survey stated that they expect low-temperature soldering to result in higher quality PCBAs.

Investigation on the Assembly Process for m03015 and a Brief Look at m0201 Components

11/14/2018 | David Geiger, Robert Pennings, and Jane Feng, Flex
Components continue to shrink in the SMT world, and the next evolution of passive components includes m03015 (009005) and m0201 (008004). The m03015 and the m0201 components will see primary adoption in products that require further miniaturization, which would be SiPs. These modules would then be assembled into products through attachment, another assembly, or via other interconnect methods. This article explores the development of an assembly process (SMT only) for the m03015 component.



Copyright © 2018 I-Connect007. All rights reserved.