Promex to Showcase Heterogenous Assembly Services for Complex Devices at ECTC

Reading time ( words)

Promex Industries Inc. will showcase its heterogenous assembly services for complex medical and biotech devices, and its Quik-Pak Division will exhibit Open-molded Plastic Packages (OmPP) and air cavity QFN (Quad Flat No-Lead) Packages in Booth 215 at The Electronic Components and Technology Conference (ECTC) in Lake Buena Vista, Florida, on May 30 to June 2, 2017.

Promex's Silicon Valley facility features a seamless transition from engineering to production using data-driven, documentation-oriented processes. The company integrates RoHS-optimized SMT with semiconductor microelectronic packaging and assembly. In-house wafer thinning, dicing, wirebond, flip chip and overmolding services are supported by an engineering team with more than 35 years of experience. Fully controlled process flows ensure high reliability manufacturing. Promex offers Class 100 and 1000 clean rooms, is ITAR registered and ISO 13485:2003 and ISO 9001:2008 certified.

Quik-Pak's OmPPs and air cavity QFNs are available in off-the-shelf and custom configurations for prototype, mid volume and production volume requirements. OmPPs feature gold plating for wire bondability and thermal regulation, RoHS- and REACH-compliant green molding compound, short, highly conductive interconnects and JEDEC outlines with matching ceramic, plastic and glass lids. Quik-Pak also offers complete assembly services to help accelerate time to market, including flip chip and wire bonding (Au, AI and Cu from 0.6-20 mil diameters), wafer thinning, dicing, and pick and place.

ECTC is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE. This international event brings together the best in packaging, components and microelectronic systems science, technology and education. It will feature advanced packaging, modeling and simulation, optoelectronics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF and emerging technologies.


Suggested Items

Preparing the Next-gen Tech Workforce

05/18/2022 | Marc Carter, Independent Contributor
Knowledge transfer, especially from the “graying-out” experienced technical workers in our industry, is a complex, difficult family of problems. It differs wildly between companies, and even within divisions of the same company. One of the biggest barriers is the full manufacturing schedules in North American electronics companies that don’t leave any slack time—and the 40-hour work week is a complete fantasy for many.

Are Your Existing Machines Enough to Keep Up?

05/04/2022 | Jennifer Davis, Arch Systems
Buy new or make do? It’s an age-old debate for manufacturers who are trying to decide how best to manage machine assets inside their manufacturing facilities. New machines are expensive, but so is operating existing machines at a comparative deficit.

Finding Solutions in the Quoting Process

05/03/2022 | Duane Benson, Screaming Circuits
It’s easy to frame all our supply chain woes around the COVID-19 pandemic. However, at Screaming Circuits, we started receiving dire warnings about component shortages in early 2018. At that time, we were told that the supply upheaval could last years and that we should expect it to get much worse before it got better. Now, four years later, I would say those warnings nailed it.

Copyright © 2022 I-Connect007. All rights reserved.