Promex to Showcase Heterogenous Assembly Services for Complex Devices at ECTC


Reading time ( words)

Promex Industries Inc. will showcase its heterogenous assembly services for complex medical and biotech devices, and its Quik-Pak Division will exhibit Open-molded Plastic Packages (OmPP) and air cavity QFN (Quad Flat No-Lead) Packages in Booth 215 at The Electronic Components and Technology Conference (ECTC) in Lake Buena Vista, Florida, on May 30 to June 2, 2017.

Promex's Silicon Valley facility features a seamless transition from engineering to production using data-driven, documentation-oriented processes. The company integrates RoHS-optimized SMT with semiconductor microelectronic packaging and assembly. In-house wafer thinning, dicing, wirebond, flip chip and overmolding services are supported by an engineering team with more than 35 years of experience. Fully controlled process flows ensure high reliability manufacturing. Promex offers Class 100 and 1000 clean rooms, is ITAR registered and ISO 13485:2003 and ISO 9001:2008 certified.

Quik-Pak's OmPPs and air cavity QFNs are available in off-the-shelf and custom configurations for prototype, mid volume and production volume requirements. OmPPs feature gold plating for wire bondability and thermal regulation, RoHS- and REACH-compliant green molding compound, short, highly conductive interconnects and JEDEC outlines with matching ceramic, plastic and glass lids. Quik-Pak also offers complete assembly services to help accelerate time to market, including flip chip and wire bonding (Au, AI and Cu from 0.6-20 mil diameters), wafer thinning, dicing, and pick and place.

ECTC is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE. This international event brings together the best in packaging, components and microelectronic systems science, technology and education. It will feature advanced packaging, modeling and simulation, optoelectronics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF and emerging technologies.

Share

Print


Suggested Items

Real Time with… SMTAI 2020: Insituware Offers Handheld Process Controls for the Smart Factory

09/21/2020 | Real Time with...SMTAI
Nolan Johnson speaks with Insituware CEO and Chief Engineer Michael Frederickson. Insituware’s expertise in materials control and measurement brings some innovative new handheld measurement devices to the manufacturing floor. Mike and Nolan discuss how these new devices contribute to accuracy, compliance, and real-time process optimization—all key factors in the smart factory environment. Mike also teases what the company will demonstrate in their virtual booth at SMTAI.

Real Time with…SMTAI 2020: SMTA International Goes Virtual

09/16/2020 | Nolan Johnson, I-Connect007
Nolan Johnson connected with three SMTA principals—KYZEN’s Debbie Carboni, SMTA’s Ryan Flaherty, and Rockwell’s Greg Vance—to discuss the upcoming 2020 SMTA International (SMTAI) event, the first major electronics manufacturing conference and exhibition to go virtual this year. The panel gives an overview of exhibits, technical conference presentations, and professional networking in this new format. and provides some coaching on how to to get the most from this virtual event.

Real Time with…SMTAI 2020: Koh Young on New Products and the Role of AI

09/16/2020 | I-Connect007 Editorial Team
Nolan Johnson speaks with Joel Scutchfield, director of sales for the Americas, about Koh Young's exhibit at SMTAI. Scutchfield outlines all the new products being displayed in the virtual booth and discusses the increased role that the company sees for AI in their products and the smart factory flow.



Copyright © 2020 I-Connect007. All rights reserved.