Flex Announces 2017 Preferred Supplier Award Recipients


Reading time ( words)

EMS firm Flex recently honored the recipients of its 2017 Preferred Supplier Awards at this year’s Global Supplier Summit, hosted at the Flex Customer Innovation Center, in the heart of the Silicon Valley. The Awards recognize outstanding performance, strategic value-add, excellent service, innovation and collaboration. Suppliers selected for the awards were nominated by Flex procurement and supply chain professionals and employees in various business groups.

"Flex recognizes and applauds the contributions of our preferred suppliers for their unwavering dedication and commitment to providing operational excellence," said Tom Linton, chief procurement and supply chain officer at Flex. "We are pleased to honor these great companies with our 2017 Preferred Supplier Award."

Companies being recognized include: Advanced MP Technology, Aero-Space Southwest Inc., Aerotek, AFP Inc., AIM Solder, Allied Universal Security, Alpha & Omega Semiconductor, Alpha Assembly Solutions, America II Electronics, American Express Global Business Travel, Amphenol AICC, Analog Devices, Ancra International LLC, Apacer, Arrow Electronics, ASM Assembly Systems, Avnet, AVX Corporation, BizLink Technology Inc., Bonteck Preceision Co. Ltd., Bossard, Bourns, Box, Boyd Corporation, Bruschi Spa, CCL Design Electronics, CEME S.p.A., Chemi-Con Inc, Chilisin Electronics Corp., Converge, Covestro LLC, Cypress Semiconductor, Damco, Demand Options Sdn Bhd, Demsa, DHL, Digi-Key Electronics, Diodes Incorporated, EDOM Technology, EDP Mexico, Engel A, EPE, EVE Energy Co. Ltd, Everrise, FedEx, Fujitsu Components, Future Electronics, GFD, GS Corporation, GSI Technology, Hardware Specialty, Heller Industries Inc, Henkel, Indium Corporation, Induspac, Infineon, ISSI, KEMET Electronics, Kester, Kingbright, KOA Speer Electronics Inc., Laird Technologies, Littelfuse Inc., Lotte Advanced Material, Lufthansa, Lumentum, Macronix, Manpower, Maquiladora Grafica Mexicana, Marian Inc., Marriott International, Inc., Mass Precision, Maxim Integrated, McNair New Power Co. Ltd, Microchip Technology Inc., Micron, Milacron LLc, Modern Precision Plastic & Mould, Molex, Motivating Graphics, Multitech Industries, Murata, Nagase, Nanhai Huanggang Metal Products Co., Nanya Technology Corp. USA, NEC Tokin, Nefab Packaging, Nexperia, NF Smith, Nichicon Corporation, NVD, Okta, Olympic Country Co. Ltd, OMP Mechtron S.p.A., ON Semiconductor, O-Net Communications, Panalpina Inc., Pencom, Penn Engineering & Manufacturing Corp., Philips, Planview, Polymer Technology & Services, PolyOne Corporation, Polyplas Sdn.Bhd., Pulse Electronics, Qualcomm, Rand Technology, Randstad, Red Board Ltd, RiseSmart, a Randstad Company, RocTool, SABIC, Samsung Electronics, Samsung Electro Mechanics, Samtec, Seaway Plastics Engineering LLC, Serviacero Worthington, Simula Technology Inc., SK hynix, Soluciones en Empaque y Logistica SA de CV, Sourceability North America LLC, STMicroelectronics, Sunningdale Tech, Sunshine Global Circuits, Supply Technologies, Suyin Corporation, Taiyo Yuden Co., TDK Corporation, TE Connectivity, Tenpao International Group Ltd, Texas Instruments, Tianma Microelectronics, Toshiba, TR Fastenings, Tripod Technology Corporation, TTI Inc., TTM Technologies, TXC, United Airlines, United Sheetmetal, Ureblock, Velocity Electronics, Vishay, Walsin Technology, Wittmann/Battenfeld, Workday, WPG, XDC Industries, Yageo, Yan Tat Industrial, Yuto Printing, and Zoppas.

About Flex

Flex is the Sketch-to-Scale™ solutions provider that designs and builds Intelligent Products for a Connected World™. With approximately 200,000 professionals across 30 countries, Flex provides innovative design, engineering, manufacturing, real-time supply chain insight and logistics services to companies of all sizes in various industries and end-markets. For more information, click here.

Share

Print


Suggested Items

Optimizing Solder Paste Volume for Low-Temperature Reflow of BGA Packages

07/22/2019 | Keith Sweatman, Nihon Superior Co. Ltd
In this article, Keith Sweatman explains how the volume of low-melting-point alloy paste—which delivers the optimum proportion of retained ball alloy for a particular reflow temperature—can be determined by reference to the phase diagrams of the ball and paste alloys.

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 1)

07/16/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
Since 2006 and the implementation of the RoHS directive, the interest in bismuth-tin solder alloys—whose melting point around 140°C is very desirable because it allows for the use of lower temperature laminate materials and reduces thermal stress on sensitive components—has only increased as the industry has searched for Pb-free alternatives to the chosen standard, SAC305, which melts at considerably higher temperatures than the incumbent tin-lead alloys.

Surface Treatment Enabling Low-Temperature Soldering to Aluminum

07/15/2019 | Divyakant Kadiwala, Averatek Corporation
An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on polyester (Al-PET) substrates. This material is gaining popularity and has found wide use in RFID tags, low-cost LED lighting, and other single-layer circuits. However, both aluminum and PET have their own constraints and require special processing to make finished circuits.



Copyright © 2019 I-Connect007. All rights reserved.