SMTA Capital Chapter Expo and Tech Forum to be Held on August 24


Reading time ( words)

The SMTA Capital Chapter is inviting the industry to its upcoming Capital Expo and Tech Forum, which will be held at Johns Hopkins University/Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, Maryland, on August 24.

During this year's expo, the Capital Chapter will host technical presentations by ITM Consulting, Summit Interconnect, and GVD Corp. Specific topics include "The 'Deadly Sins' of SMT Assembly," "Density, Advanced Materials and Cost Drivers Associated with Advanced Circuit Design, Fabrication and Assembly," and, "Reliability without Hermeticity: Commercial Vapor Deposited Coatings for High-Frequency RF Micro-Electronics."

Registration opens at 8 am and includes a complimentary lunch on the show floor. Exhibits are open from 9-3 pm and the first technical presentation will start at 9:30 am.

To register online to attend or exhibit, please click here.

Share

Print


Suggested Items

Oren Manor on the Siemens-Mentor Integration

11/26/2019 | Real Time with...productronica
In this video interview, part of the productronica coverage, the I-Connect007 team speaks with Oren Manor, director of business development for Siemens, in the Siemens booth. Oren introduces us to the in-booth production equipment that integrates factory automation, motion controls, and MES solutions. He points out that the recent effort to automate SMT lines is now expanding into the areas of final assembly, box build, and manual assembly as well.

Meet Zulki Khan, SMT007 Columnist

10/25/2019 | I-Connect007
Meet Zulki Khan, one of our newest SMT007 columnists! Khan’s columns address new frontiers in upcoming manufacturing techniques, including challenges in the marriage of SMT and microelectronics manufacturing and the critical aspects involved.

IPC Electronics Materials Forum 2019

10/16/2019 | IPC
IPC will be holding its Electronics Materials Forum 2019 from November 5–7, 2019, in Bloomington, Minnesota. The Electronics Materials Forum is a new technical conference focused on developments in materials and processes associated with advanced electronics assembly and manufacturing.



Copyright © 2020 I-Connect007. All rights reserved.