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The SMTA Capital Chapter is inviting the industry to its upcoming Capital Expo and Tech Forum, which will be held at Johns Hopkins University/Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, Maryland, on August 24.
During this year's expo, the Capital Chapter will host technical presentations by ITM Consulting, Summit Interconnect, and GVD Corp. Specific topics include "The 'Deadly Sins' of SMT Assembly," "Density, Advanced Materials and Cost Drivers Associated with Advanced Circuit Design, Fabrication and Assembly," and, "Reliability without Hermeticity: Commercial Vapor Deposited Coatings for High-Frequency RF Micro-Electronics."
Registration opens at 8 am and includes a complimentary lunch on the show floor. Exhibits are open from 9-3 pm and the first technical presentation will start at 9:30 am.
To register online to attend or exhibit, please click here.
Stephen Las Marias, I-Connect007
Garret Maxson, manager of engineering services at American Computer Development Inc. (ACDi), discusses the PCB assembly challenges when dealing with high-density interconnect (HDI) boards, parameters to consider, and strategies to help facilitate a smooth assembly process when using HDI boards.
Neil Sharp, JJS Manufacturing
Rather than viewing outsourcing as a way to offload unwanted tasks, OEMs should spend time carefully selecting and then maintaining a properly managed relationship with their chosen EMS partner. Here are five simple elements that you should focus on before, during and after an outsourcing strategy to guarantee it is a success.
Michael Ford, Aegis Software Corp.
The rise in the ingress of counterfeit materials into the supply chain has made them prolific, though yet, the extent is understated. What needs to be faced now is the need for incoming inspection, but at what cost to industry, and does anyone remember how to do it?