SEHO North America to Hold Technology Days in Kentucky


Reading time ( words)

SEHO North America, Inc. announced that it will hold its 2017 Technology Days in conjunction with guest presenters from ULT LLC (fume extraction technologies), DCT Czech (process cleaning technologies) and Stannol GmbH (soldering flux technologies). The event is scheduled to take place July 25-26, 2017 at SEHO’s North America new technology center in Erlanger, Kentucky.

This year’s NA Technology Days will be an event not to be missed, with exciting product introductions and intensive hands-on training.

SEHO Technology Days are designed to provide a perfect balance of theory and practical application. In addition to hands on trainings, this year’s event will include presentations from leading flux, solder and equipment suppliers. Industry experts will present their latest findings and share expert insight on the latest industry issues and trends.

Topics of discussion will include resource-efficient and cost-effective wave soldering as well as automated selective soldering process control with a focus on zero-defect process.

Experts will provide tips for detecting defects early to optimize the THT production process, and solutions with creative systems for automatic board handling and material management. Guest presenters also will address effective fume extractions in electronics manufacturing, maintenance cleaning of soldering technology, and the changing requirements for fluxes and solders over the last decade.

The Technology Days are part of the successful SEHO Academy with more than 1,000 satisfied attendees worldwide. SEHO's training courses can help qualified employees optimize processes to improve production throughput, reduce cycle times, improve the level of quality, and reduce overall cost.

Share


Suggested Items

Video from productronica 2017: Mycronic Discusses Precision Jetting Systems

11/17/2017 | I-Connect007
From the show floor during productronica 2017, Clemens Jargon, VP of Global Dispensing at Mycronic, discusses with I-Connect007 Technical Editor Pete Starkey the company’s portfolio of precision jetting equipment, with particular reference to the speed and versatility of the MYSmart series.

Solder Preforms 101: Ask the Expert

11/13/2017 | Patty Goldman, I-Connect007
At the recent SMTA International 2017 event, Jerry Sidone, product manager for the engineered materials at Alpha Assembly Solutions, speaks with I-Connect007 Managing Editor Patty Goldman about the voiding challenge, especially with bottom termination components, and how solder technologies from Alpha are helping PCB assemblers address this issue.

HDI Considerations: Interview with ACDi's Garret Maxson

11/10/2017 | Stephen Las Marias, I-Connect007
Garret Maxson, manager of engineering services at American Computer Development Inc. (ACDi), discusses the PCB assembly challenges when dealing with high-density interconnect (HDI) boards, parameters to consider, and strategies to help facilitate a smooth assembly process when using HDI boards.



Copyright © 2017 I-Connect007. All rights reserved.