AIM Appoints SmartSol Technologies as New Rep in Baja California, Mexico


Reading time ( words)

AIM Solder is pleased to announce the addition of SmartSol Technologies as a new representative for its complete line of solder products, including solder paste, liquid flux, bar, wire, as well as other solder assembly materials. SmartSol Technologies will support AIM customers in Baja California, Mexico.

Established in 2012, SmartSol Technologies is renowned for providing the best services and products to the electronics assembly industry in Mexico. With over twenty years of experience, the SmartSol sales team is committed to providing customers in the automotive, electronics assembly and the green technology markets with the best solutions available.

“We’re pleased to welcome SmartSol Technologies as our new representative in Baja California, Mexico,” said Andy Dolan, AIM’s Vice President of Sales. “We’re confident that SmartSol will provide unsurpassed support to AIM customers in the area.”

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training.

Share


Suggested Items

Video from productronica 2017: Mycronic Discusses Precision Jetting Systems

11/17/2017 | I-Connect007
From the show floor during productronica 2017, Clemens Jargon, VP of Global Dispensing at Mycronic, discusses with I-Connect007 Technical Editor Pete Starkey the company’s portfolio of precision jetting equipment, with particular reference to the speed and versatility of the MYSmart series.

Solder Preforms 101: Ask the Expert

11/13/2017 | Patty Goldman, I-Connect007
At the recent SMTA International 2017 event, Jerry Sidone, product manager for the engineered materials at Alpha Assembly Solutions, speaks with I-Connect007 Managing Editor Patty Goldman about the voiding challenge, especially with bottom termination components, and how solder technologies from Alpha are helping PCB assemblers address this issue.

HDI Considerations: Interview with ACDi's Garret Maxson

11/10/2017 | Stephen Las Marias, I-Connect007
Garret Maxson, manager of engineering services at American Computer Development Inc. (ACDi), discusses the PCB assembly challenges when dealing with high-density interconnect (HDI) boards, parameters to consider, and strategies to help facilitate a smooth assembly process when using HDI boards.



Copyright © 2017 I-Connect007. All rights reserved.