TRI to Redefine High-Speed Inspection at NEPCON South China


Reading time ( words)

Test Research Inc. (TRI) will feature a new generation of high-performance SPI, AOI, AXI and ICT inspection solutions at the NEPCON South China 2017 exhibition, which will be held from August 29–31, 2017, at the Shenzhen Convention & Exhibition Center. TRI will be in Booth 1E65.

TRI.jpg

TRI's new 2017 lineup introduces the TR7600 SIII 3D CT X-ray inspection, which brings together exceptional imaging quality, ultra-high performance and smart inspection software in the industry's most advanced 3D AXI solution.

The TR7500QE stop-and-go 3D AOI system is designed for best inspection coverage with maximum accuracy with 2D+3D clear image and accurate 3D solder inspection. Now featuring CoaXPress for industry leading inspection performance. 

The full lineup is joined by TR7007Q, a high accuracy 3D SPI designed for industry's smallest SMT components, and completed by TRI's award-winning ICT solution TR5001D SII INLINE, which features latest parallel testing technology and almost unlimited expandability.

Discover how TRI's complete range of PCBA test solutions works together to bring you maximum value in production line and minimize production costs. All TRI solutions are designed to interoperate with other manufacturing equipment; by integrating with YMS 4.0 yield management solution and Industry 4.0-based productions, they can help to minimize down times, optimize production quality and reduce operator work load.

About TRI

TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. For more information, click here.

Share


Suggested Items

Cleaning Trends: The Challenges of Miniaturization and Proximity

11/01/2017 | Patty Goldman, I-Connect007
At the recent SMTA International conference, I-Connect007 Managing Editor Patty Goldman caught up with Ram Wissel, VP of Global Technology at KYZEN, to talk about the latest cleaning challenges, and bringing Industry 4.0 into the world of cleaning in PCB assembly.

Is Hybrid Technology Gaining Momentum?

10/02/2017 | Dieter G. Weiss, Weiss Engineering
Over the past 20 years, ceramic hybrids have changed more and more to a backyard living in the European electronics industry, mainly driven by price pressure, specifically from the automotive electronics industry.

IPC’s David Bergman on Industry Training and Education

09/29/2017 | Stephen Las Marias, I-Connect007
David Bergman, vice president of standards and technology at IPC, talks about the biggest issues facing the electronics manufacturing industry now. He also explains how the organization helps elevate the industry through its training, continuous education, and standards development.



Copyright © 2017 I-Connect007. All rights reserved.