-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
STI Acquires Fischerscope X-ray XDAL 237
July 20, 2017 | STI Electronics, Inc.Estimated reading time: 1 minute
STI Electronics Inc. has acquired a new Fischerscope X-ray XDAL 237 energy dispersive X-ray fluorescence (EDXRF) system.
The Fischerscope EDXRF measuring instrument has a silicon drift detector, allowing a higher resolution for light elements, from aluminum Al (13) to uranium U (92). Not only can this system non-destructively measure various plating thicknesses on printed circuit boards and/or components, it also can measure and analyze very thin coatings (
The measurements of the plating thickness include but are not limited to the following plating stack-up combinations:
- Electroless Nickel / Immersion Gold (ENIG)
- Gold / Palladium / Nickel / Copper
- Immersion Tin / Copper
- Immersion Silver / Copper
- Tin-Lead / Copper
Mark McMeen, Vice President of Engineering Services, said, "This additional capability to perform non-destructive determination of the weight percentage of Pb (lead) and Sn (tin) in the plating accommodates the growing need for this type of testing. With both the SEM/EDS and the new EDXRF, STI’s Analytical Services Department can now better provide for customer demands."
About STI Electronics Inc.
Since 1982, STI Electronics Inc. (STI) has been the premier full-service organization for training, consulting, laboratory analysis, prototyping, and small-to-medium volume contract PCB assembly in the electronics industry. STI also produces a complete line of solder training kits and training support products. For more information, click here.
Suggested Items
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation are proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia. on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.