TRI Features 3D Micro SMD Inspection at SEMICON Taiwan 2017

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Test Research Inc. (TRI) will showcase its latest 3D SPI and 3D AOI solutions specialized at micro SMD inspection at SEMICON Taiwan, which will be held from September 13-15, 2017, at the Taipei Nangang Exhibition Center. Combining 5.5 µm resolution with optional vacuum fixtures, TRI inspection systems are ready to inspect micro components on a variety of substrates. TRI will be at Booth 908 on 4F.

TRI will feature the TR7007Q SPI and brand new TR7500QE 3D AOI systems based on TRI's latest digital fringe projection technology. The micro SMD specialized TR7700E SIII AOI inspection system includes a vacuum-based fixture for accurate handling of thin and flexible substrates.

About TRI

TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. For more information, visit


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