Koh Young Technology Receives Bosch Global Supplier Award

Reading time ( words)

Koh Young Technology has received a supplier award in the 'purchasing of indirect material' category at Robert Bosch GmbH's recent Global Supplier Award 2017. The award recognizes outstanding performance Koh Young’s employees made in 2015-2016.

This year, Bosch has given awards to 44 suppliers from 11 countries for outstanding performance in the manufacture and supply of products—notably in the areas of quality, costs, innovations, and logistics. Globally, Koh Young is the second SMT-related company to win this kind of award from Bosch among thousands of suppliers.


Dr. Kwangill Koh, CEO of Koh Young Technology, received the award presented by Prof. Dr. Stefan Asenkerschbaumer, deputy chairman of the board of management of Robert Bosch GmbH.

The theme of this year's award ceremony was "Partners in Success" because to Bosch, its suppliers are not only deliverers of parts and component, but also partners in development and innovation who help them stay competitive. At the ceremony, Dr. Stefan Asenkerschbaumer praised all the award-winners. "Our goal is to achieve supply chain excellence. This will work only when all partners are intelligently connected with one another," he says.

"We are incredibly honored to receive this award from Bosch, who has been our trusted partner for more than 10 years. Without help of partners like Bosch, we cannot stay ahead of the technology curve," says Dr. Koh. "I hereby thank Bosch for their continued support and all our employees for making this possible."

About Koh Young Technology Inc.

Koh Young Technology, a leading provider of solder paste inspection (SPI) and automated optical inspection (AOI) systems, specializes in the design and manufacturing of 3D measurement and inspection equipment for the global circuit board assembly and semiconductor markets. Direct sales and support centers are located in the United States, Germany, Japan, Singapore, China and Korea. For more information, visit www.kohyoung.com.


Suggested Items

Video from productronica 2017: Mycronic Discusses Precision Jetting Systems

11/17/2017 | I-Connect007
From the show floor during productronica 2017, Clemens Jargon, VP of Global Dispensing at Mycronic, discusses with I-Connect007 Technical Editor Pete Starkey the company’s portfolio of precision jetting equipment, with particular reference to the speed and versatility of the MYSmart series.

Solder Preforms 101: Ask the Expert

11/13/2017 | Patty Goldman, I-Connect007
At the recent SMTA International 2017 event, Jerry Sidone, product manager for the engineered materials at Alpha Assembly Solutions, speaks with I-Connect007 Managing Editor Patty Goldman about the voiding challenge, especially with bottom termination components, and how solder technologies from Alpha are helping PCB assemblers address this issue.

HDI Considerations: Interview with ACDi's Garret Maxson

11/10/2017 | Stephen Las Marias, I-Connect007
Garret Maxson, manager of engineering services at American Computer Development Inc. (ACDi), discusses the PCB assembly challenges when dealing with high-density interconnect (HDI) boards, parameters to consider, and strategies to help facilitate a smooth assembly process when using HDI boards.

Copyright © 2017 I-Connect007. All rights reserved.