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SMART Group members and non-members are invited to join any or all of the following webinars, seminars, and workshops on soldering and assembly processes and issues, for production and quality managers, technicians and engineers.
The below educational events aim to help manufacturers improve yields and reduce costs:
Solderability Benchmarking, Failures & Testing Methods (Webinar) – August 14
PCB Outgassing Issues & How to Test Bare or Assembled Boards (Webinar) – September 11
QFN/LGA & Bottom Mounted Termination Process Defects – Causes & Cures (Webinar) – September 14
Solder Shorts & How to Eliminate Them In Selective & Wave Soldering Webinar – October 17
SMART & NPL Process, Design & Reliability Seminar – November 9 (NPL Teddington)
Ball Grid Array, Bottom Mounted Components, Design, Assembly, Inspection & Defect Elimination (Webinar) – November 13
BGA, QFN Fine Pitch Rework Experience Live @ Henkel, Hemel Hempstead – November 21
For more information, visit the SMART Group website at www.smartgroup.org.
Patty Goldman, I-Connect007
At the SMTA West Penn Expo, I had a chance to discuss a paper presented by Jigar Patel, senior application engineer at ZESTRON. Jigar explained some of the cleaning challenges with newer components and how ZESTRON helps optimize cleaning processes for their customers.
Dora Yang, PCBCart
As a cutting-edge technology applied in SMT assembly, BGA packages have quickly become a significant selection to conform to fine pitch and ultrafine pitch technology, achieving high-density interconnection with a reliable assembly technology provided, which leads to the increasingly more applications of this type of package.
Real Time with... NEPCON China
At the recent NEPCON China 2018, Klaus Schubert, managing director of Armada, speaks about the increasing electrification in cars and how this is impacting the PCB assembly processes, and in particular, the solder paste printing.