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SMART Group members and non-members are invited to join any or all of the following webinars, seminars, and workshops on soldering and assembly processes and issues, for production and quality managers, technicians and engineers.
The below educational events aim to help manufacturers improve yields and reduce costs:
Solderability Benchmarking, Failures & Testing Methods (Webinar) – August 14
PCB Outgassing Issues & How to Test Bare or Assembled Boards (Webinar) – September 11
QFN/LGA & Bottom Mounted Termination Process Defects – Causes & Cures (Webinar) – September 14
Solder Shorts & How to Eliminate Them In Selective & Wave Soldering Webinar – October 17
SMART & NPL Process, Design & Reliability Seminar – November 9 (NPL Teddington)
Ball Grid Array, Bottom Mounted Components, Design, Assembly, Inspection & Defect Elimination (Webinar) – November 13
BGA, QFN Fine Pitch Rework Experience Live @ Henkel, Hemel Hempstead – November 21
For more information, visit the SMART Group website at www.smartgroup.org.
From the show floor during productronica 2017, Clemens Jargon, VP of Global Dispensing at Mycronic, discusses with I-Connect007 Technical Editor Pete Starkey the company’s portfolio of precision jetting equipment, with particular reference to the speed and versatility of the MYSmart series.
Patty Goldman, I-Connect007
At the recent SMTA International 2017 event, Jerry Sidone, product manager for the engineered materials at Alpha Assembly Solutions, speaks with I-Connect007 Managing Editor Patty Goldman about the voiding challenge, especially with bottom termination components, and how solder technologies from Alpha are helping PCB assemblers address this issue.
Stephen Las Marias, I-Connect007
Garret Maxson, manager of engineering services at American Computer Development Inc. (ACDi), discusses the PCB assembly challenges when dealing with high-density interconnect (HDI) boards, parameters to consider, and strategies to help facilitate a smooth assembly process when using HDI boards.