Reading time ( words)
Dr. Wusheng Yin, the president of YINCAE Advanced Materials, is scheduled to speak at the SMTA International 2017, which will take place at the Donald Stephens Convention Center in Rosemont, Illinois, on September 17–21, 2017.
Dr. Yin will be presenting his white paper, "High Reliability and High Temperature Application Solution – Solder Joint Encapsulant Paste," on September 20 at 9:00 am.
YINCAE Advanced Materials is pioneering the way with their unique solder joint encapsulants, underfill materials, die attach adhesives, wafer lever materials, optoelectronic materials, and conformal coatings.
To learn more about YINCAE, visit the YINCAE team at Booth 329.
From the show floor during productronica 2017, Clemens Jargon, VP of Global Dispensing at Mycronic, discusses with I-Connect007 Technical Editor Pete Starkey the company’s portfolio of precision jetting equipment, with particular reference to the speed and versatility of the MYSmart series.
Patty Goldman, I-Connect007
At the recent SMTA International 2017 event, Jerry Sidone, product manager for the engineered materials at Alpha Assembly Solutions, speaks with I-Connect007 Managing Editor Patty Goldman about the voiding challenge, especially with bottom termination components, and how solder technologies from Alpha are helping PCB assemblers address this issue.
Stephen Las Marias, I-Connect007
Garret Maxson, manager of engineering services at American Computer Development Inc. (ACDi), discusses the PCB assembly challenges when dealing with high-density interconnect (HDI) boards, parameters to consider, and strategies to help facilitate a smooth assembly process when using HDI boards.