Reading time ( words)
Dr. Wusheng Yin, the president of YINCAE Advanced Materials, is scheduled to speak at the SMTA International 2017, which will take place at the Donald Stephens Convention Center in Rosemont, Illinois, on September 17–21, 2017.
Dr. Yin will be presenting his white paper, "High Reliability and High Temperature Application Solution – Solder Joint Encapsulant Paste," on September 20 at 9:00 am.
YINCAE Advanced Materials is pioneering the way with their unique solder joint encapsulants, underfill materials, die attach adhesives, wafer lever materials, optoelectronic materials, and conformal coatings.
To learn more about YINCAE, visit the YINCAE team at Booth 329.
Patty Goldman, I-Connect007
At the SMTA West Penn Expo, I had a chance to discuss a paper presented by Jigar Patel, senior application engineer at ZESTRON. Jigar explained some of the cleaning challenges with newer components and how ZESTRON helps optimize cleaning processes for their customers.
Dora Yang, PCBCart
As a cutting-edge technology applied in SMT assembly, BGA packages have quickly become a significant selection to conform to fine pitch and ultrafine pitch technology, achieving high-density interconnection with a reliable assembly technology provided, which leads to the increasingly more applications of this type of package.
Real Time with... NEPCON China
At the recent NEPCON China 2018, Klaus Schubert, managing director of Armada, speaks about the increasing electrification in cars and how this is impacting the PCB assembly processes, and in particular, the solder paste printing.