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Dr. Wusheng Yin, the president of YINCAE Advanced Materials, is scheduled to speak at the SMTA International 2017, which will take place at the Donald Stephens Convention Center in Rosemont, Illinois, on September 17–21, 2017.
Dr. Yin will be presenting his white paper, "High Reliability and High Temperature Application Solution – Solder Joint Encapsulant Paste," on September 20 at 9:00 am.
YINCAE Advanced Materials is pioneering the way with their unique solder joint encapsulants, underfill materials, die attach adhesives, wafer lever materials, optoelectronic materials, and conformal coatings.
To learn more about YINCAE, visit the YINCAE team at Booth 329.
Pete Starkey, I-Connect007
Pete Starkey spent a few minutes at the SuperDry booth on the first day of the productroncica show, and chatted with old friend Rich Heimsch, who taught the old dog a few new tricks about the drying process.
Stephen Las Marias, I-Connect007
In an interview with SMT Magazine, Enrique Moreno, technical support engineer at JBC Soldering, discusses the key parameters to consider during hand soldering to achieve the perfect solder joint. He also talks about the the increasing move towards automation and robotics soldering.
Bob Wettermann, BEST Inc.
Higher reflow temperatures of lead-free rework increases the pressure for properly shielding the neighboring components. These developments are causing BGA rework challenges. This summary will discuss the most challenging aspects of BGA rework and options for solutions.