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AIM Solder will host a Knowledge Sharing Session in Queretaro, Qro, Mexico on August 24, 2017.
AIM’s Manuel Munguia, Senior Technical Support Engineer, will present the white paper “Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction.” Many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. Manuel’s presentation will highlight a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.
This free seminar, hosted by AIM, SmartSol Technologies and Reymet, will be held at the Holiday Inn Queretaro, Zona Krystal in Queretaro, Mexico. This Knowledge Sharing Session will consist of four conferences, with speakers from AIM, KYZEN, Nordson Matrix and ASM Technologies, covering topics from void reduction to cleaning a no-clean flux.
To register, please click here.
About Manuel Munguia
Manuel Munguia is a Certified IPC Specialist with over fifteen years of experience in the solder assembly materials industry, four of which came from his former position with AIM as a Technical Applications Engineer. In his current role as Senior Technical Support Engineer, Manuel is responsible for supporting key corporate accounts in Mexico, Central and South America.
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, click here.