iNEMI's Bill Bader to Keynote Technical Innovations Symposium at SMTA International


Reading time ( words)

Bill Bader, CEO of iNEMI, will keynote the 2017 Technical Innovations Symposium at SMTA International 2017, which will be held from September 17–21, 2017 in Rosemont, Illinois. Bader's presentation is titled "2017 iNEMI Roadmap Highlights Impacting Board Assembly over the Next 5-10 Years".

The iNEMI roadmap has become recognized as an important tool for defining the "state of the art" in the electronics industry as well as identifying emerging and disruptive technologies. The keynote presentation will discuss the major trends that will impact board and component assembly in the near future, with insights to identify potentially disruptive innovations that could be the basis for radical changes to current programs and equipment.

Bill Bader joined iNEMI in August 2009 as Chief Executive Officer. He is a 26-year veteran of Intel Corporation, and he brings to iNEMI a wide range of experience, including factory management for high-volume production, new product development, hardware and software design and test, and assembly and test technology development. He also served as Intel’s representative on the iNEMI Technical Committee from 1998 to 2005.

The Technical Innovations Symposium at SMTA International will feature new research from companies and institutions such as Celestica Inc., Centre for Mechatronics and Automation, Fraunhofer Institute, Harris Corporation, i3 Electronics, National Physical Laboratory, Plexus Corp., and more.  Session topics include Micro-Dispensing and Additive Manufacturing Developments, Adhesive and Coating Development and Characterization, Adhesive Development and Characterization, and Panel Processing Technologies for Packaging. A panel of industry experts will give short presentations and discuss current/future trends in Lead-Free and other advanced packaging technologies to wrap-up the symposium.

About SMTA - A Global Association Working at a Local Level

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

Share


Suggested Items

HDI Considerations: Interview with ACDi's Garret Maxson

11/10/2017 | Stephen Las Marias, I-Connect007
Garret Maxson, manager of engineering services at American Computer Development Inc. (ACDi), discusses the PCB assembly challenges when dealing with high-density interconnect (HDI) boards, parameters to consider, and strategies to help facilitate a smooth assembly process when using HDI boards.

5 Simple Elements to Guarantee Outsourcing Success

11/09/2017 | Neil Sharp, JJS Manufacturing
Rather than viewing outsourcing as a way to offload unwanted tasks, OEMs should spend time carefully selecting and then maintaining a properly managed relationship with their chosen EMS partner. Here are five simple elements that you should focus on before, during and after an outsourcing strategy to guarantee it is a success.

Counterfeit: A Quality Conundrum

10/18/2017 | Michael Ford, Aegis Software Corp.
The rise in the ingress of counterfeit materials into the supply chain has made them prolific, though yet, the extent is understated. What needs to be faced now is the need for incoming inspection, but at what cost to industry, and does anyone remember how to do it?



Copyright © 2017 I-Connect007. All rights reserved.