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TE Connectivity (TE) a two-piece pluggable connector solution designed with surface mount technology (SMT). The family includes surface mount headers and mating plugs in vertical and right-angle configurations between two and twelve positions giving manufacturers design flexibility.
Target applications for TE’s new BUCHANAN WireMate connector Surface Mount TB series include HVAC equipment and controls, industrial controls, security systems, industrial lighting solutions, and elevators and escalators. These connectors are designed for manufacturers looking to make the change to full SMT printed circuit boards (PCBs) or requiring a product capable of withstanding reflow soldering temperatures. TE’s BUCHANAN WireMate connector Surface Mount TB series allows for faster PCB assembly, and optional SMT retention features further ensure secure PCB mounting. The connectors have tin-plated copper alloy contacts, and the housing material has a UL 94 V-0 flammability rating.
BUCHANAN WireMate connector Surface Mount TB series are available with 3.5 mm and 5.0 mm centerlines. The 3.5mm centerline offering accepts 30 - 16AWG and is rated for 8A at 300V. The 5.0mm centerline accepts 26 -12 AWG wire gauge and is rated 15A (2-9 positions) at 300 V or 10A (10-12 positions) at 300V.
For more information on TE’s BUCHANAN WireMate connector Surface Mount TB series, click here.
01/08/2018 | Bob Wettermann, BEST Inc.
There are a variety of reasons behind pads getting "lifted" completely or partially from the laminate of a PCB. Per the just revised IPC-A-610 Revision G, a defect for all three classes occurs when the land is lifted up one or more pad thicknesses. Lifted pads can occur when a device has been improperly removed or there is a manufacturing defect in the board construction. In any case, as with any repair, the ultimate decision on the ability to repair the pad lies with the customer.
01/05/2018 | Stephen Las Marias, I-Connect007
It seems like it wasn't too long ago when I was writing about the optimism of the electronics manufacturing and assembly industry going into 2017. Now, here we are again at the beginning of the new year, looking at new trends, disruptive technologies, and emerging markets for 2018. I am also proud to announce our new branding as well as our fresh, new look.
12/14/2017 | Marco Lajoie and Alain Breton, C-MAC Microelectronics
The volume of solder deposition, like any process, has variations that may be characterized by a statistical distribution curve, whether normal or non-normal. As complexity, density, cost and reliability requirements increase, there may be value in narrowing the distribution curve. It is common sense that less variation serves the interest of quality of the more complex and dense circuit boards.