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TE Connectivity (TE) a two-piece pluggable connector solution designed with surface mount technology (SMT). The family includes surface mount headers and mating plugs in vertical and right-angle configurations between two and twelve positions giving manufacturers design flexibility.
Target applications for TE’s new BUCHANAN WireMate connector Surface Mount TB series include HVAC equipment and controls, industrial controls, security systems, industrial lighting solutions, and elevators and escalators. These connectors are designed for manufacturers looking to make the change to full SMT printed circuit boards (PCBs) or requiring a product capable of withstanding reflow soldering temperatures. TE’s BUCHANAN WireMate connector Surface Mount TB series allows for faster PCB assembly, and optional SMT retention features further ensure secure PCB mounting. The connectors have tin-plated copper alloy contacts, and the housing material has a UL 94 V-0 flammability rating.
BUCHANAN WireMate connector Surface Mount TB series are available with 3.5 mm and 5.0 mm centerlines. The 3.5mm centerline offering accepts 30 - 16AWG and is rated for 8A at 300V. The 5.0mm centerline accepts 26 -12 AWG wire gauge and is rated 15A (2-9 positions) at 300 V or 10A (10-12 positions) at 300V.
For more information on TE’s BUCHANAN WireMate connector Surface Mount TB series, click here.
11/06/2017 | Reza Ghaffarian, Jet Propulsion Laboratory, California Institute of Technology
Electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish for PCBs has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This article presents the reliability of LGA component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.
10/30/2017 | Stephen Las Marias, I-Connect007
For this month's issue of SMT Magazine, we brought several experts together to discuss the many aspects of soldering, from solder paste, to automation, inspection, and the challenges in achieving the perfect solder joint. We also talked about the strategies and parameters to consider to ensure reliable, good solder joints.
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Over the past 20 years, ceramic hybrids have changed more and more to a backyard living in the European electronics industry, mainly driven by price pressure, specifically from the automotive electronics industry.