Magneti Marelli Selects Goepel X-ray Inspection System


Reading time ( words)

Italian automotive supplier Magneti Marelli has decided on two X-ray inspection systems from Goepel electronic for quality assurance of electronic assemblies. At production sites in France and Slovakia, the X Line 3D systems are used to inspect high-complexity PCBs.

Electronic assemblies for automobiles are subject to particularly high quality requirements by the manufacturers. The X Line 3D is an inline X-ray system for high-end 3D inspection of non-visible or concealed solder joints in large-scale production. The three-dimensional X-ray inspection covers both top and bottom sides within a continuous process. The basis of this technology is real-time multi-angle image acquisition, which allows a complete 3D capture of the assembly. Integrated reconstruction methods provide detailed evaluation of the PCB under test, layer by layer.

Frédéric_Preteseille.jpg 

Frédéric Preteseille in front of the X Line 3D at Magneti Marelli in Châtellerault Cedex, France

Goepel electronic is a leading provider of innovative test and inspection solutions for printed circuit board assemblies (PCBAs) and electronic devices and systems. The company is divided into four divisions:

  • Automotive Test Solutions
  • Embedded JTAG Solutions
  • Industrial Function Test
  • Inspection Solutions AOI·AXI·SPI·IVS

For more information, visit www.goepel.com.

Share


Suggested Items

Under the Hood: Solder Joint Reliability

05/21/2018 | Burton Carpenter, NXP Semiconductors Inc.
It has been long established that packages using NSMD BGA pads were more resilient than ones with SMD pads to fatigue-induced solder joint cracks. However, NSMD pads in previous investigations on 292MAPBGA and 416PBGA packages failed sooner in AATS testing due to an alternate failure mode: substrate Cu trace cracks. This article looks into the effects of substrate material and package pad design on solder joint reliability of 0.8 mm pitch BGA.

Solving Reliability and Thermal Management Challenges in Automotive Electronics

05/01/2018 | Stephen Las Marias, I-Connect007
Paul Salerno, global portfolio manager for SMT assembly solutions at Alpha Assembly Solutions, discusses the growing automotive electronics industry, its impact on the soldering materials business, and how Alpha helps customers address the new challenges and requirements in the automotive market.

Investigating Analytical Tools for Testing Cleanliness with Foresite's Eric Camden

04/19/2018 | Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.



Copyright © 2018 I-Connect007. All rights reserved.