Magneti Marelli Selects Goepel X-ray Inspection System


Reading time ( words)

Italian automotive supplier Magneti Marelli has decided on two X-ray inspection systems from Goepel electronic for quality assurance of electronic assemblies. At production sites in France and Slovakia, the X Line 3D systems are used to inspect high-complexity PCBs.

Electronic assemblies for automobiles are subject to particularly high quality requirements by the manufacturers. The X Line 3D is an inline X-ray system for high-end 3D inspection of non-visible or concealed solder joints in large-scale production. The three-dimensional X-ray inspection covers both top and bottom sides within a continuous process. The basis of this technology is real-time multi-angle image acquisition, which allows a complete 3D capture of the assembly. Integrated reconstruction methods provide detailed evaluation of the PCB under test, layer by layer.

Frédéric_Preteseille.jpg 

Frédéric Preteseille in front of the X Line 3D at Magneti Marelli in Châtellerault Cedex, France

Goepel electronic is a leading provider of innovative test and inspection solutions for printed circuit board assemblies (PCBAs) and electronic devices and systems. The company is divided into four divisions:

  • Automotive Test Solutions
  • Embedded JTAG Solutions
  • Industrial Function Test
  • Inspection Solutions AOI·AXI·SPI·IVS

For more information, visit www.goepel.com.

Share


Suggested Items

Video from productronica 2017: Mycronic Discusses Precision Jetting Systems

11/17/2017 | I-Connect007
From the show floor during productronica 2017, Clemens Jargon, VP of Global Dispensing at Mycronic, discusses with I-Connect007 Technical Editor Pete Starkey the company’s portfolio of precision jetting equipment, with particular reference to the speed and versatility of the MYSmart series.

Solder Preforms 101: Ask the Expert

11/13/2017 | Patty Goldman, I-Connect007
At the recent SMTA International 2017 event, Jerry Sidone, product manager for the engineered materials at Alpha Assembly Solutions, speaks with I-Connect007 Managing Editor Patty Goldman about the voiding challenge, especially with bottom termination components, and how solder technologies from Alpha are helping PCB assemblers address this issue.

HDI Considerations: Interview with ACDi's Garret Maxson

11/10/2017 | Stephen Las Marias, I-Connect007
Garret Maxson, manager of engineering services at American Computer Development Inc. (ACDi), discusses the PCB assembly challenges when dealing with high-density interconnect (HDI) boards, parameters to consider, and strategies to help facilitate a smooth assembly process when using HDI boards.



Copyright © 2017 I-Connect007. All rights reserved.