-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Akrometrix Launches New Tabletop Shadow Moiré at SMTA International
August 15, 2017 | Akrometrix LLCEstimated reading time: 1 minute
Akrometrix, LLC will display its newest warpage metrology system in Booth #124 at SMTA International, scheduled to take place Sept. 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, Illinois. The new Tabletop Shadow Moiré (TTSM) system responds to the industry’s demand for an ultra-fast tabletop warpage metrology system.
The TTSM offers all of the software features of Akrometrix’s thermal warpage metrology systems, only at room temperature. Akrometrix is the industry leader in not only providing thermal warpage, but has optional modules for both DIC strain/CTE measurements and DFP for discontinuous surfaces. Utilizing a novel combination of both top and bottom heaters with shadow moiré, Akrometrix is providing temperature uniformity previously unattainable in the industry on a flexible/configurable platform.
The TTSM enables customers to measure warpage of substrates up to 300mm x 310 mm (a 300mm wafer or two JEDEC trays) with the entire measurement taking less than two seconds. Whether individual parts or a JEDEC tray of multiple parts, the TTSM provides an ultra-fast and highly accurate measurement at room temperature that is suited for tabletop use.
About Akrometrix LLC
Akrometrix is the leader in thermal warpage and strain metrology for the front-end/back-end wafer, back-end packaging/assembly, panel and the PCB/component markets. The company provides both capital equipment and test services to measure warpage and strain in temperatures from -50°C to 300°C on virtually any substrate up to 600mm x 600mm, regardless of shape. Located in Atlanta, Georgia, Akrometrix has been serving customers worldwide for more than 20 years based on technology developed at Georgia Tech. For more information click here.
Suggested Items
Nihon Superior Sets New Standards in Lead-Free Soldering Technology at APEX 2024
03/13/2024 | PVANihon Superior Co. Ltd., an advanced joining material supplier, will exhibit in Booth 1325 during the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California.
Indium Corporation to Showcase Proven EV Products and High-Reliability Alloys at Productronica China
02/28/2024 | Indium CorporationAs a materials pioneer and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 20-22, in Shanghai.
UL-Authorization Received for Ventec High-CTI, Halogen Free FR15.1 Substrates VT-447C and VT-441C
02/27/2024 | VentecVentec International Group Co., Ltd. , is pleased to announce that UL’s evaluation of two of Ventec’s halogen-free, phenolic cured high-CTI substrates have received authorization to apply the UL mark.
KIC to Discuss Revolutionary Contact-less Thermal AnalysisTM at SMTA Dallas Expo and Tech Forum
02/09/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, will exhibit its latest breakthrough technology, Contact-less Thermal AnalysisTM, at the SMTA Dallas Expo and Tech Forum.
AIM to Highlight NC259FPA Ultrafine Solder Paste & Present on Low Temp Solder at IPC APEX 2024
02/09/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming IPC APEX EXPO 2024 taking place April 9-11 at the Anaheim Convention Center in Anaheim, California.