TXP's iPhotonics Division Finalizes License Agreement With Siemens for ONT Technologies


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TXP Corporation, a global provider of Pre-Manufacturing Services for the electronics and telecommunications industries today announced that it has finalized its license agreement with Siemens Networks Germany granting access to more than 15 patents surrounding its Optical Network Terminal (ONT) technology, supporting both Broadband Passive Optical Network (BPON) and Gigabit Passive Optical Network (GPON) standards.

Michael C. Shores, President and CEO, stated, "Finalizing this license and asset transfer agreement now allows us to focus on commercialization of the ONT technology, which is a critical component of the "triple-play" roll-outs which are currently being deployed by the carriers nationwide. Under the new licensing agreement, we are now responsible for overseeing manufacturing and will have rights to market and immediately begin selling the ONT technology. In addition, Siemens is transferring all of its related assets, which will allow us to ramp up quickly, to meet the anticipated demand from the carriers."

PON is a point-to-multipoint, fiber to the premises network architecture, in which unpowered or passive optical splitters are used to connect a single optical fiber to multiple premises. The ONT technology to be further developed and marketed by TXP's iPhotonics division terminates the PON at the home or business location, and enables integrated voice, video and high-speed internet access.

About TXP

TXP, based in Richardson, Texas, is a global provider of Pre-Manufacturing Services for the electronics industry, supporting original equipment manufacturers, original design manufacturers, contract manufacturers and new technology innovators. The company excels in both design and supply chain solutions services for new product development which include prototyping and quick-turn electronic assembly, new product introduction, pilot production, material supply chain management as well as the transfer of product into production. TXP's core technology focus is on complex printed circuit board assemblies, photonics, optoelectronics, and advanced packaging solutions, while forging profitable business opportunities with well-positioned high speed, digital, analog, and RF technologies and industries that require complementary service requirements. By working closely with its customers and being highly responsive to their requirements throughout the design processes, TXP believes that it can be an integral part of its customers' operations, accelerate their time-to-market and time-to-volume production and reduce their product costs. TXP has three operating divisions that build on its core Design for Manufacturability foundation: TXP-Texas Prototypes, TXP-Retrofit Solutions, and iPhotonics. For more information visit: www.iphotonics.com.

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