Indium to Host Seminar on Void-Reducing Technologies for Infrastructure and Communications

Reading time ( words)

Indium Corporation will co-host a seminar with Process Lab.Micron on Advanced Void-Reducing Technologies for Infrastructure and Communications on August 24 in Shanghai, China.

The seminar will include an introduction to Indium Corporation’s latest halogen-free, Pb-free, no-clean, low-voiding solder paste technology, Indium10.1HF, by Dr. Ning-Cheng Lee and Mary Ma.

Technical experts will lead discussions on:

  • InFORMS® and Solder Preforms in Electronics Assembly by Sunny Neoh Soon Chye
  • DFX on High-Density Assembly by Wisdom Qu
  • Semiconductor Materials for Infrastructure and Communications by Aaron Yan

Dr. Ning-Cheng Lee, Indium Corporation Vice President of Technology, will provide a session focusing on:

  • Low temperature solders
  • High-reliability solder alloy for wide service temperature capability
  • Pressureless Ag/Cu sintering paste

For more information or to register for this seminar, contact

About Indium

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit

About Process Lab.Micron

Process Lab.Micron Co., Ltd. is a stencil manufacturer known for developing numerous groundbreaking technologies, such as additive and laser-cut stencils, which have become well established in the stencil industry. The company develops, manufactures, and sells metal masks for electronics component mounting, and precision versions for semiconductor packages and display masks. Process Lab.Micron also performs precision machining and prototyping by etching, plating, and laser cutting. For more information on Process Lab.Micron, visit


Suggested Items

Under the Hood: Solder Joint Reliability

05/21/2018 | Burton Carpenter, NXP Semiconductors Inc.
It has been long established that packages using NSMD BGA pads were more resilient than ones with SMD pads to fatigue-induced solder joint cracks. However, NSMD pads in previous investigations on 292MAPBGA and 416PBGA packages failed sooner in AATS testing due to an alternate failure mode: substrate Cu trace cracks. This article looks into the effects of substrate material and package pad design on solder joint reliability of 0.8 mm pitch BGA.

Solving Reliability and Thermal Management Challenges in Automotive Electronics

05/01/2018 | Stephen Las Marias, I-Connect007
Paul Salerno, global portfolio manager for SMT assembly solutions at Alpha Assembly Solutions, discusses the growing automotive electronics industry, its impact on the soldering materials business, and how Alpha helps customers address the new challenges and requirements in the automotive market.

Investigating Analytical Tools for Testing Cleanliness with Foresite's Eric Camden

04/19/2018 | Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.

Copyright © 2018 I-Connect007. All rights reserved.