AIM Solder’s Mehran Maalekian to Present at SMTAI 2017


Reading time ( words)

AIM Solder's R&D Manager Dr. Mehran Maalekian will present the white paper “New Pb-Free Solder Alloy for Demanding Applications" at SMTA International 2017, scheduled to take place on September 17–20, 2017 at the Donald Stephens Convention Center in Rosemont, Illinois. AIM will be located in Booth 408.

Dr. Maalekian’s paper explores industry need for solder alloys that can perform in harsh service conditions and examines potential solutions. Applications such as high-performance LED lighting and automotive applications require solder alloys to operate at high temperatures where commonly used SAC305 may be prone to failure. The challenges potential new high-reliability alloys present are associated with processing and manufacturability difficulties. This study’s focus is a new Sn-Ag-Cu-Bi-X solder alloy (X represents micro alloying dopants) with favorable processing capabilities and significant improvements in reliability. The study demonstrates how the new multi-component solder alloy, which provides improved thermo-mechanical performance, can be an ideal solder material for severe operating environment applications.

Additionally, AIM will highlight its full line of advanced solder materials, including its newly developed high reliability alloys, REL61 and REL22, its solder paste, liquid flux and solder alloys. REL61 addresses the most challenging issues with today’s common lead-free alloys, specifically soldering performance, cost, durability and tin whiskers.  To discover all of AIM’s products and services, visit the company at SMTAI 2017 for more information.

Dr. Maalekian is experienced in materials engineering with a focus on physical metallurgy, soldering, modelling in materials engineering, metal forming and thermo-mechanical processes. Dr. Maalekian has received numerous recognitions including the National Sciences and Engineering Research Council of Canada Award, the International Henry Granjon Prize (IIW), and IWS-Sossenheimer Award. He has been awarded the honor of Speaker of Distinction by the Surface Mount Technology Association (SMTA). Dr. Maalekian has published many scientific and technical papers, serves as a reviewer of several scientific journals, and is on the editorial board of “Science and Technology of Welding and Joining.”

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training.

For more information about AIM, visit www.aimsolder.com.

Share


Suggested Items

Video from productronica 2017: Mycronic Discusses Precision Jetting Systems

11/17/2017 | I-Connect007
From the show floor during productronica 2017, Clemens Jargon, VP of Global Dispensing at Mycronic, discusses with I-Connect007 Technical Editor Pete Starkey the company’s portfolio of precision jetting equipment, with particular reference to the speed and versatility of the MYSmart series.

Solder Preforms 101: Ask the Expert

11/13/2017 | Patty Goldman, I-Connect007
At the recent SMTA International 2017 event, Jerry Sidone, product manager for the engineered materials at Alpha Assembly Solutions, speaks with I-Connect007 Managing Editor Patty Goldman about the voiding challenge, especially with bottom termination components, and how solder technologies from Alpha are helping PCB assemblers address this issue.

HDI Considerations: Interview with ACDi's Garret Maxson

11/10/2017 | Stephen Las Marias, I-Connect007
Garret Maxson, manager of engineering services at American Computer Development Inc. (ACDi), discusses the PCB assembly challenges when dealing with high-density interconnect (HDI) boards, parameters to consider, and strategies to help facilitate a smooth assembly process when using HDI boards.



Copyright © 2017 I-Connect007. All rights reserved.