Dr. Jennie Hwang to Speak on Reliability of Electronics at SMTAI 2017


Reading time ( words)

Solder joint reliability plays a critical role in the reliability of the entire spectrum of end-use electronic products from consumer to industrial, from computing to IoT, from medical to military applications. In lead-free electronics, intermetallic compounds become increasingly important to the performance and reliability of solder interconnections in the chip level, package level and board level.

Understanding the essential fundamentals and key factors behind intermetallics and solder joint reliability is a necessity to designing and manufacturing reliable products.

At the upcoming SMTA International 2017 conference, Dr. Jennie S. Hwang leverages her decades of comprehensive real-world experiences and deep knowledge to address solder joint reliability and the role of intermetallic compounds by integrating scientific fundamentals with practical requirements. Dr. Hwang will discuss relevant aspects of solder joint reliability at her Workshop 12 – “Solder Joint Reliability - Principles and Applications,” and Workshop 18 – “Reliability of Electronics – The Role of Intermetallic Compounds.” Attendees are encouraged to bring their own selected systems for deliberation.

For more information, click here.

To register, click here.

Share


Suggested Items

Indium's Karthik Vijay Talks Engineering for Automotive Applications

01/22/2018 | Barry Matties, I-Connect007
Barry Matties met with Karthik Vijay, Indium Corporation's technical manager for Europe, at last year's productronica, where everything from stencils and laser cutting to flux technology and jetting were discussed. If you want to know about where material technology currently stands in the automotive landscape, you’ll want to read on.

PCB Pad Repair Techniques

01/08/2018 | Bob Wettermann, BEST Inc.
There are a variety of reasons behind pads getting "lifted" completely or partially from the laminate of a PCB. Per the just revised IPC-A-610 Revision G, a defect for all three classes occurs when the land is lifted up one or more pad thicknesses. Lifted pads can occur when a device has been improperly removed or there is a manufacturing defect in the board construction. In any case, as with any repair, the ultimate decision on the ability to repair the pad lies with the customer.

Top 10 Most-Read SMT007 Columns of 2017

01/02/2018 | I-Connect007
Another year is over in the SMT industry. 2017 saw a myriad of hot topics, including Industry 4.0, the millennials’ entry into the manufacturing space, and alternative solder materials, to name a few. Without further ado, here are the Top 10 columns from SMT007 over the past year.



Copyright © 2018 I-Connect007. All rights reserved.