Seika Machinery's Michelle Ogihara to Chair MSD Council Meeting at SMTAI


Reading time ( words)

Seika Machinery, Inc. announces that Michelle Ogihara, Senior Sales Manager at Seika, will co-chair the MSD Council Meeting with Mumtaz Bora, Peregrine Semiconductor, at SMTA International. The meeting is scheduled to take place Tuesday, September 19, 2017 at 2 p.m. in the Boardroom, Upper Level, South Ballroom of the Donald E. Stephens Convention Center, Rosemont, Illinois.

During this important meeting, speaker Steve Martel of Sonoscan, Inc. will provide updates and changes to J-STDS 020, 033 & 075 as well as Package Handling/Baking/Packaging Guidelines, PWB Handling/ Baking/Packaging Guidelines, Updates – IPC 1601 Standard, and Controls at PWB/Assembly Site. Please join us to learn as well as offer your suggestions.

The council is a voluntary group, under the auspices of the SMTA, dedicated to advancing the understanding and practice of moisture-sensitive devices control in electronic assembly procedures and practices. All council members and anyone interested may attend this meeting. No reservations required. For more information, contact Michelle Ogihara at Michelle@seikausa.com.

The MSD Council serves industry professionals who are SMTA members that have an interest in moisture sensitive devices. Specifically, the council represents engineering, production management, quality assurance and reliability, research, sales and marketing, education, purchasing, and other functions. For more information about the MSD Council, click here.

About Seika Machinery, Inc.

Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services. For more information about Seika Machinery, click here.

Share


Suggested Items

Modeling an SMT Line to Improve Throughput

06/06/2018 | Gregory Vance, Rockwell Automation Inc., and Todd Vick, Universal Instruments Corp.
One of the major challenges for an electronics assembly manufacturing engineer is determining how an SMT machine will impact throughput. Typically, an SMT equipment supplier will ask for a few products to simulate the throughput capability of their machine. Unfortunately, if the engineer works in a high-mix, low-volume environment, he may need to know the impact of a new machine on 1,000 or more products.

RTW IPC APEX EXPO: Indium's Brook Sandy-Smith on PMI-Squared

05/25/2018 | Real Time with...IPC
Indium Corporation's Brook Sandy-Smith discusses ionic process residues on PCB assemblies and introduces the concept of "PMI-squared" (process material interaction investigation), the topic of an IPC Technical Buzz Session at IPC APEX EXPO 2018.

RTW IPC APEX EXPO: Inspection Technology Developments

05/22/2018 | Real Time with...IPC
Brian D'Amico, president of Mirtec Corp., speaks with I-Connect007 Technical Editor Pete Starkey about the challenges of miniaturization, increasing component density, and the shadowing of small components by taller ones, and how Mirtec has developed its inspection technology to ensure they remain at the leading edge.



Copyright © 2018 I-Connect007. All rights reserved.