KYZEN's Dr. Mike Bixenman Co-Authors Three Papers for SMTAI 2017


Reading time ( words)

KYZEN CTO Dr. Mike Bixenman has co-authored three papers that will be presented during the technical conference at SMTA International 2017. The SMTA International Technical Conference is scheduled to take place September 17-21, 2017 at the Donald E. Stephens Convention Center in Rosemont, Illinois.

The presentation entitled "Cleanliness Process Control – An Innovative Approach to a Complex Problem," and co-authored by Mark McMeen and Jason Tynes, STI Corporation, and David Lober, KYZEN, is scheduled to take place during the Spotlight 4 session on Process Control. Mark McMeen will be presenting.

Surface Insulation Resistance (SIR) testing has commonly been performed by electronics testing labs on industry specific test boards. With the adoption of bottom terminated components, there has been a void for a process control method at the assembly site for measuring electro-chemical reliability. The purpose of this research is to development and validate an SIR process control method that can be implemented at the assembly site. 

The presentation entitled “Dendritic Growth from Chemical Contamination and Partial Cleaning: Fundamental Tests and Application Study,” and co-authored by Bruno Tolla, Ph.D., Denis Jean, Jennifer Allen & Kyle Loomis, KESTER Corporation, and David Lober, KYZEN, will take place during the Flux, Solder, Adhesives Track on Wednesday, Sept. 20 at 11 a.m. Mike Bixenman will be presenting

The purpose of this study is to analyze at a fundamental level the impact of various chemical residues on dendritic growth and corrosion of conductive traces and to correlate these electrochemical effects with real-life application conditions. For this purpose, a non-standard test board enables the quantification of the dendritic growth kinetics between Y-shaped traces, in function of the chemical residue characteristics and environmental conditions.

The presentation entitled, “Localized Ion Chromatography Method Development and Validation,” co-authored by Mark McMeen and Jason Tynes, STI Corporation, and David Lober, KYZEN, will take place during the Cleaning Session on Thursday, Sept. 21 at 9:00 a.m.

Component specific test boards developed for both localized IC and SIR testing allow for analyzing problematic ions and electrical resistance responses on specific bottom terminated components. The area where the component is placed is routed out on the test board so the specific component can undergo localized testing. The purpose of this research paper is to develop and validate localized IC testing.

Bixenman has more than 20 years of experience in the design of electronic assembly cleaning materials and process integration. He held the position of IPC/SMTA Cleaning Symposium Chair over the last 10 years and is the current chair of the IPC Cleaning Handbook Task Group. Bixenman holds four earned degrees including a Doctorate in Business Administration.

About KYZEN

KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards. For more information, click here.

Share


Suggested Items

Jigar Patel on ZESTRON’s Reliability Solutions for Class 3 Assemblies

06/14/2018 | Patty Goldman, I-Connect007
At the SMTA West Penn Expo, I had a chance to discuss a paper presented by Jigar Patel, senior application engineer at ZESTRON. Jigar explained some of the cleaning challenges with newer components and how ZESTRON helps optimize cleaning processes for their customers.

Elements to Consider on BGA Assembly Process Capability

06/05/2018 | Dora Yang, PCBCart
As a cutting-edge technology applied in SMT assembly, BGA packages have quickly become a significant selection to conform to fine pitch and ultrafine pitch technology, achieving high-density interconnection with a reliable assembly technology provided, which leads to the increasingly more applications of this type of package.

RTW NEPCON China: Armada Discusses Impact of Auto Electrification on PCB Assembly

06/01/2018 | Real Time with... NEPCON China
At the recent NEPCON China 2018, Klaus Schubert, managing director of Armada, speaks about the increasing electrification in cars and how this is impacting the PCB assembly processes, and in particular, the solder paste printing.



Copyright © 2018 I-Connect007. All rights reserved.