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iNEMI to Hold Roadmap Webinar on Packaging and Component Substrates
August 29, 2017 | iNEMIEstimated reading time: Less than a minute
New architectures and platforms are emerging to populate cloud infrastructures. Because of this, packaging technologies will be required to provide higher performance, lower power, increased physical density of bandwidth and decreased latency — all at no increase in cost.
The 2017 iNEMI Roadmap chapter on packaging and component substrates is intended to provide focus and direction to industry, academia and government on critical technology trends and motivations for research needed to meet next-generation packaging requirements.
The webinar will be held on August 30, 2017, and will be presented by Bill Bottoms (3MTS), Chair, Packaging & Component Substrates TWG, 2017 iNEMI Roadmap.
For more information or to register, click here.
Suggested Items
Yamaha to Showcase Latest-generation Assembly Equipment and Software Tools at SMTconnect
04/16/2024 | Yamaha Robotics SMT SectionYamaha Robotics SMT Section will team with its distributor ANS Elektronik to showcase innovations for high-speed surface mount assembly at SMTconnect 2024.
Plasmatreat at IPC APEX EXPO 2024
04/02/2024 | PlasmatreatFor the pretreatment of highly sensitive electronic components, Plasmatreat will present a real innovation at the IPC APEX Expo in Anaheim 2024: The new REDOX tool safely and effectively reduces oxide layers on electronic components in an inline process.
Elementary, Mr. Watson: Ensuring Design Integrity
03/28/2024 | John Watson -- Column: Elementary, Mr. WatsonBack in February, many of us watched the "Big Game." It reminded me of the saying, “It's not how you start that is important, but rather how you finish." It is perfectly okay when you are talking about sports, you get off to a bad first half and need to recover in the second half. However, when it comes to PCB design, this is not a good practice. If things start badly, they usually don't recover. They continue down that same path, costing more money and losing design time.
Würth Elektronik Presents LEDs with Integrated Controllers
03/27/2024 | Würth ElektronikWürth Elektronik now offers WL-ICLED, a new series of RGB LEDs with integrated controller (IC). The components, controllable as pixels, combine a red, green and blue LED with a programmable contoller IC.
Mycronic to Showcase More Versatile, High-productivity Assembly Solutions at IPC APEX EXPO 2024
03/27/2024 | MycronicMycronic, the leading Sweden-based electronics assembly solutions provider, will continue to respond to growing customer demand for high-flexibility, high-productivity solutions for zero-defect PCB assembly at IPC APEX EXPO 2024 in Anaheim, CA on April 9 - 11.