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New architectures and platforms are emerging to populate cloud infrastructures. Because of this, packaging technologies will be required to provide higher performance, lower power, increased physical density of bandwidth and decreased latency — all at no increase in cost.
The 2017 iNEMI Roadmap chapter on packaging and component substrates is intended to provide focus and direction to industry, academia and government on critical technology trends and motivations for research needed to meet next-generation packaging requirements.
The webinar will be held on August 30, 2017, and will be presented by Bill Bottoms (3MTS), Chair, Packaging & Component Substrates TWG, 2017 iNEMI Roadmap.
For more information or to register, click here.
Pete Starkey, I-Connect007
Pete Starkey spent a few minutes at the SuperDry booth on the first day of the productroncica show, and chatted with old friend Rich Heimsch, who taught the old dog a few new tricks about the drying process.
Joerg Nolte, Ersa GmbH
In the assembly of bottom terminated components (BTC), the formation of voids has become a serious problem in many applications. In the SMT process, the reliability of solder joints becomes more of a concern, as less and less solder is allowed for each joint. The presence of voids can deteriorate the joint strength and eventually lead to joint failure.
David Hillman, Rockwell Collins
Several electronic market segments, such as those electronics used in harsh environments or that have life/system critical functionality, remain exempt from lead-free material restrictions such as the RoHS legislation. While these market segments can use solder containing lead, it is increasingly difficult to procure advanced components in non-ROHS compliant configurations. This article discusses several aspects of having lead-free BGA components in a tin/lead soldering process.