RTW NEPCON South China: KYZEN on Optimizing the Cleaning Process


Reading time ( words)

At the NEPCON South China event happening this week in Shenzhen, China, Thomas Forsythe, executive vice president at KYZEN Corp., discusses with I-Connect007 Managing Editor Stephen Las Marias the current cleaning challenges in the PCB assembly industry. He also talks about the key parameters that manufacturers should consider to optimize their cleaning process.

Watch the interview here.

Share


Suggested Items

The Survey Said: Industry Optimistic After Strong 2017

05/24/2018 | I-Connect007 Research Team
During recent trade shows and conferences, we spoke with a variety of fabricators and assembly providers. They had one thing in common: Every company achieved strong growth in 2017, and shared a positive outlook about the future. This year, the industry is optimistic, driven by positive economic outlook, growing customer demand, and new technologies and vertical markets, among others.

RTW IPC APEX EXPO: Mycronic Broadens Product Portfolio

04/26/2018 | Real Time with...IPC
Thomas Stetter, senior vice president of assembly at Mycronic, discussed with I-Connect007's Pete Starkey how their company continues to broaden their product portfolio towards a full-line SMT solution and the Industry 4.0 automated factory.

RTW IPC APEX EXPO: Asteelflash Expansion Plans and Industry Challenges

03/02/2018 | Real Time with...IPC
Mathieu Kury, business development manager at EMS firm Asteelflash, discusses the company's expansion plans and activities amid the growing demand in the automotive electronics space.



Copyright © 2018 I-Connect007. All rights reserved.