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At the NEPCON South China event happening this week in Shenzhen, China, Thomas Forsythe, executive vice president at KYZEN Corp., discusses with I-Connect007 Managing Editor Stephen Las Marias the current cleaning challenges in the PCB assembly industry. He also talks about the key parameters that manufacturers should consider to optimize their cleaning process.
Watch the interview here.
Patty Goldman, I-Connect007
I-Connect007's Patty Goldman caught up with Juki Automation’s Bill Astle during a luncheon on the last day of IMPACT Washington D.C., 2018. As a first-time attendee, Bill came away feeling like he made the right connections with key members of Congress, and he looks forward to returning to the event in the future.
I-Connect007 Research Team
During recent trade shows and conferences, we spoke with a variety of fabricators and assembly providers. They had one thing in common: Every company achieved strong growth in 2017, and shared a positive outlook about the future. This year, the industry is optimistic, driven by positive economic outlook, growing customer demand, and new technologies and vertical markets, among others.
Real Time with...IPC
Thomas Stetter, senior vice president of assembly at Mycronic, discussed with I-Connect007's Pete Starkey how their company continues to broaden their product portfolio towards a full-line SMT solution and the Industry 4.0 automated factory.