Reading time ( words)
At the NEPCON South China event happening this week in Shenzhen, China, Thomas Forsythe, executive vice president at KYZEN Corp., discusses with I-Connect007 Managing Editor Stephen Las Marias the current cleaning challenges in the PCB assembly industry. He also talks about the key parameters that manufacturers should consider to optimize their cleaning process.
Watch the interview here.
Patty Goldman, I-Connect007
At the recent SMTA International conference, I-Connect007 Managing Editor Patty Goldman caught up with Ram Wissel, VP of Global Technology at KYZEN, to talk about the latest cleaning challenges, and bringing Industry 4.0 into the world of cleaning in PCB assembly.
Dieter G. Weiss, Weiss Engineering
Over the past 20 years, ceramic hybrids have changed more and more to a backyard living in the European electronics industry, mainly driven by price pressure, specifically from the automotive electronics industry.
Stephen Las Marias, I-Connect007
David Bergman, vice president of standards and technology at IPC, talks about the biggest issues facing the electronics manufacturing industry now. He also explains how the organization helps elevate the industry through its training, continuous education, and standards development.