AIM’s Flopy Feng Receives Best Presentation Award at the SMTA China South Technology Conference


Reading time ( words)

AIM Solder is pleased to announce that Flopy Feng, Technical Support Engineer, received the award for Best Presentation in his technical session at the SMTA China South Technology Conference in Shenzhen, China.

Flopy’s presentation, titled “The Impact of Reduced Solder Alloy Powder Size on Solder Paste Print Performance,” generated great interest among attendees. It highlighted the benefits and implications of finer mesh solder powder on critical aspects of solder paste performance. In this study, the key input variables included powder size, effect of room temperature storage, pause time and PCB feature types.  Output included print transfer efficiency, volume repeatability and performance stability over time.

Flopy Feng is a Technical Support Engineer for AIM Solder. Having worked as a process supervisor for seven years, he is experienced in process evaluation and optimization. With over fourteen years’ experience in the SMT industry, Flopy supports AIM customers in south China. 

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, click here.

Share


Suggested Items

Jigar Patel on ZESTRON’s Reliability Solutions for Class 3 Assemblies

06/14/2018 | Patty Goldman, I-Connect007
At the SMTA West Penn Expo, I had a chance to discuss a paper presented by Jigar Patel, senior application engineer at ZESTRON. Jigar explained some of the cleaning challenges with newer components and how ZESTRON helps optimize cleaning processes for their customers.

Elements to Consider on BGA Assembly Process Capability

06/05/2018 | Dora Yang, PCBCart
As a cutting-edge technology applied in SMT assembly, BGA packages have quickly become a significant selection to conform to fine pitch and ultrafine pitch technology, achieving high-density interconnection with a reliable assembly technology provided, which leads to the increasingly more applications of this type of package.

RTW NEPCON China: Armada Discusses Impact of Auto Electrification on PCB Assembly

06/01/2018 | Real Time with... NEPCON China
At the recent NEPCON China 2018, Klaus Schubert, managing director of Armada, speaks about the increasing electrification in cars and how this is impacting the PCB assembly processes, and in particular, the solder paste printing.



Copyright © 2018 I-Connect007. All rights reserved.