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The Surface Mount Technology Association (SMTA) LA/OC and San Diego chapters will be sponsoring an advanced packaging and electronics assembly presentation and facility tour at Kulicke & Soffa Industries (KNS) on September 6, 2017.
The event will feature a short presentation by Quan Bui, manager of the product management division at Kulicke & Soffa, who will provide an overview of the latest semiconductor packaging and electronic assembly solutions for automotive, consumer, communications, computing and industrial segments. Semiconductor, advanced packaging, electronics assembly, wedge bonding and a broad range of expendable tools for the next-generation of electronic devices will also be covered. The facility tour, meanwhile, will provide a great opportunity to get pointers and ideas to solve your most challenging assembly equipment issues.
For more information, or to register, click here.
Every year, we like to take a look back at the most popular SMT news and articles. These are the top 10 most-read SMT articles from the past year.
Neeta Agarwal, et al.*
SMT stencil printing technology continually evolves to keep pace with device miniaturization technologies. Printed circuit board assemblers have numerous new technology options to choose from, and need to determine the most effective ones to produce the highest quality and most reliable solder interconnections.
Marco Lajoie and Alain Breton, C-MAC Microelectronics
The volume of solder deposition, like any process, has variations that may be characterized by a statistical distribution curve, whether normal or non-normal. As complexity, density, cost and reliability requirements increase, there may be value in narrowing the distribution curve. It is common sense that less variation serves the interest of quality of the more complex and dense circuit boards.